High-Performance Printed Electronics
Virtual presentation by Prof. Ravinder Dahiya, Electrical and Computer Engineering at Northeastern University
Abstract
The miniaturization led advances in silicon-based micro/nanoelectronics on planar and stiff substrates, have revolutionized nearly every socio-economic sector through fast computing and communication. However, miniaturization alone is insufficient as several emerging applications (e.g., robotics, interactive systems, wearables, flexible displays etc.) require electronics with features such as flexible form factors, and seamlessly integrated on soft substrates. The environmental impact of inherently wasteful fabrication steps in conventional micro/nanofabrication is also a growing concern. As a result, new resource-efficient methods are being explored to fabricate electronic devices and circuits on unconventional flexible and stretchable substrates. This talk will present recent advances in this direction, particularly focussing on hybrid or heterogenous integration of the off-the-shelf devices, ultra-thin chips, and high-mobility semiconducting nanostructures-based printed electronics. The talk will also cover innovative resource efficient methods such as transfer printing, contact printing and direct-roll printing etc. that are expected to transform the way electronics will be manufactured in future.
Date and Time
Location
Hosts
Registration
- Date: 05 Jun 2024
- Time: 06:30 PM to 08:00 PM
- All times are (UTC-07:00) Pacific Time (US & Canada)
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Jeronimo Segovia-Fernandez
IEEE SFBA MEMS & Sensors Chapter, Chair
- Starts 30 May 2024 05:18 PM
- Ends 05 June 2024 06:30 PM
- All times are (UTC-07:00) Pacific Time (US & Canada)
- No Admission Charge
- Menu: IEEE Member, Non-IEEE Member
Speakers
Prof. Ravinder Dahiya
Biography:
Ravinder Dahiya is Professor in the Department Electrical and Computer Engineering at Northeastern University, Boston, USA. His group (Bendable Electronics and Sustainable Technologies (BEST)) conducts research in flexible printed electronics, electronic skin, and their applications in robotics, wearables, and interactive systems. He has authored or co-authored more than 500 publications, books and submitted/granted patents and disclosures. He has led or contributed to many international projects.
Prof. Dahiya is serving on Board of Directors of IEEE as Division X Director-Elect and is the Past President of IEEE Sensors Council. He is the Editor-in-Chief (EiC) of NPJ Flexible Electronics. He was the founding EiC of IEEE Journal on Flexible Electronics. He has been on the editorial boards of several other journals. He founded the IEEE International Conference on Flexible, Printed Sensors and Systems (FLEPS) and has served as General Chair or Technical Programme Chair of several international conferences. He is recipient of EPSRC Fellowship, Marie Curie Fellowship and Japanese Monbusho Fellowship and has received several awards, including Technical Achievement award from IEEE Sensors Council, Young Investigator Award from Elsevier, and 13 best journal/conference paper awards as author/co-author. He is Fellow of IEEE and the Royal Society of Edinburgh.
Personal website: www.rsdahiya.com
Research Group website: https://best.sites.northeastern.edu
Agenda
6:30 – 6:45 PM Registration & Networking
6:45 - 6:50 PM Chapter Announcements
6:50 - 7:10 PM 2023 MEMS Report Card
7:10 – 7:50 PM Invited Talk
7:50 – 8:00 PM Questions & Answers