Eric Wolf of Application Engineer - Nano Dimension

Overview:

Adding the capability of solder paste jetting to SMT lines provides major advantages to the standard process. Three main reasons will be highlighted: Flexible iteration for NPI and prototyping, supplementing screen printers to increase accuracy and reduce additional steps, and the ability to handle non-traditional and non-planar boards such as 3D printed boards.

Biography:

Eric Wolf

With a B.S. in Electrical Engineering and experience in both the medical device and metals additive field, Eric joined the DragonFly applications team in July of 2022. After joining the Essemtec applications team in March of 2023, he handled dispense and pick & place applications for all North America. With strong Design for Manufacturing experience and an understanding of both machines, Eric has led multiple collaborations between DragonFly and Fox and continues to test advanced assembly applications that can be scaled to the production level.

Dr. Ryan Bahr of Electronics Additive Manufacturing Manager-Nano Dimension

Overview:

In this presentation we discuss a variety of applications that have seen success with additively manufactured electronics, ranging from a discussion on rigid flex, interposers/legacy support, and RF applications.

Biography:

Dr. Ryan Bahr is currently the additively manufactured electronics manager at Nano Dimension in the US. He specialized in additively manufactured flexible RF electronics, including 3D and phased array design for SATCOM/5G, gradient metamaterials, and electrical characterization of printed materials. He received a Ph.D. in electrical engineering at the Georgia Institute of Technology focusing on the use of inkjet-printing and 3D printing for antennas, sensors, origami-electronics, packaging, energy harvesting, and mm-wave devices up to 110 GHz. He previously designed Ku-band 3D phased arrays for LEO SATCOM user terminals as well as led RF design, simulation, and measurement setups. He's actively involved in several review and technical committees, including IEEE RFID, IEEE Microwave and Component Letters, IEEE Microwave Theory and Techniques, Antenna and Propagation Symposium, and Additive Manufacturing.