IEEE MTT-S DML Seminar - Millimeter-wave Transceiver Chips with Antenna in Package
Abstract
The increasing requirements of wireless communications and sensors are making research and commercialization of millimeter-wave integrated circuits and antennas experience tremendous growth. The advancement of modern CMOS technology facilitates it to become a prevailing technology to achieve low-cost and compact millimeter-wave integrated circuits. Meanwhile, the compound semiconductor is still a must for low noise and high power millimeter-wave system. As the operating frequency enters the millimeter-wave regime, the circuit component's size becomes comparable to the electromagnetic wave wavelength. Therefore, a mixed design methodology using both the lumped and distributed elements in the millimeter-wave integrated circuit design is of great interest, not only compound semiconductor but also CMOS integrated circuits. On one hand, to achieve high-integration and high-pwerformance, the heterogeneous packaging architecture combined the merits of both CMOS and compound semiconductor millimeter-wave integrated circits is becoming an attractive technology. On the other hand, considering the efficiency, cost, and integration of advanced wireless systems, discrete antenna is no longer suitable for millimeter-wave wireless systems. Therefore, antenna-in-package (AiP) has become the mainstream for millimeter-wave system, which implements an antenna or antennas on (or in) package of chips leading to a high efficiency and highly-integrated radio. In this talk, innovative on millimeter-wave integrated circuits，subsystems and corresponding antenna-in-package will be introduced.
Speaker’s Bioraphy
Professor Xue began his professional career in the Universisty of Electronic Science and Technology of China (UESTC) in 1993 as a Lecturer, immidately after he obtained his Ph.D. In 1997, he became a Professor in UESTC then moved to Chinese University of Hong Kong to work as a Research Associate and then a Research Fellow. In 1999, he joined the City University of Hong Kong as Senior Scientific Officer, and then promoted as Assciate Professor, Professor, and Chair Professor of Microwave Engineering. He also served the University as the Associate Vice President, the Director of Information and Communication Technology Center, and the Deputy Director of the State Key Lab of Millimeter Waves (Hong Kong). In 2017, he joined South China University of Technology. Now he is a Professor and serves as the Dean of the School of Electronics and Information Engineering, the Dean of the School of Microelectronics, and the Director of the Guangdong Key Laboratory of Terahertz and Millimeter Waves. He also served as the Chief Scientist of Antenna in the 2012 Labs of Huawei Technologies (2020-2023). His is a member of Chinese National 6G Technology General Expert Group. He has published over 600 internationally refereed journal papers and over 300 international conference papers. In addition, he has held more than 100 Chinese patents and more than 50 granted US patents. Prof. XUE's research interests include microwave/millimeter-wave/THz passive components, active components, antenna, microwave monolithic integrated circuits, etc.
Date and Time
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Registration
- Date: 06 Aug 2024
- Time: 09:30 AM to 11:00 AM
- All times are (UTC+10:00) Sydney
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- Room 408, Level 6, Building 11
- Sydney, New South Wales
- Australia 2007
- Building: Building 11
- Room Number: Room 408
- Click here for Map
- Starts 31 July 2024 12:00 AM
- Ends 06 August 2024 12:00 AM
- All times are (UTC+10:00) Sydney
- No Admission Charge