Next-Generation Advanced Manufacturing for Aerospace Wireless Systems – From Conformal Metasurface Antennas to High-Temperature RF and Photonics Packaging
IEEE North Jersey Section AP/MTT Jt. Chapter Co-Sponsors the TALK: "Next-Generation Advanced Manufacturing for Aerospace Wireless Systems – From Conformal Metasurface Antennas to High-Temperature RF and Photonics Packaging"
Key topics included in this talk are the latest advancements in 3D antennas and RF/photonic packaging, focusing on cutting-edge Advanced Manufacturing (AM) processes such as micro-dispensing, two-photon polymerization, femtosecond laser machining, and aerosol jetting. These processes are crucial for developing high-performance wireless hardware for highly specialized low-volume space applications. Additionally, the seminar will explore aerospace-grade materials, emphasizing their electromagnetic and mechanical properties that ensure compatibility with space conditions. Finally, the talk will present practical examples of RF/photonic packaging and 3D conformal metasurface antennas, highlighting their potential to revolutionize space communications. Attendees will gain insights into the future directions of wireless technologies in the space industry and the innovative solutions driving this exciting frontier.
Date and Time
Location
Hosts
Registration
- Date: 13 Aug 2024
- Time: 12:00 PM to 01:00 PM
- All times are (GMT-05:00) US/Eastern
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- Contact Event Hosts
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Ajay Poddar (akpoddar@ieee.org), Edip Niver (edip.niver@njit.edu), (Anisha Apte (anisha_apte@ieee.org)
- Co-sponsored by IEEE North Jersey Section
Speakers
Dr. Eduardo A. Rojas-Nastrucci
Next-Generation Advanced Manufacturing for Aerospace Wireless Systems – From Conformal Metasurface Antennas to High-Temp
Over the last decade, the commercial space sector has seen exponential growth, driving significant advancements in wireless communication technologies. The space environment presents unique challenges affecting wireless systems' performance and reliability, especially regarding bandwidth, range, coverage, adaptability, and electronics' survivability. This seminar will offer a comprehensive overview of the state-of-the-art wireless technologies shaping the space industry and discuss the future trends and innovations in this dynamic area.
From an engineering perspective, successful space-based wireless communications depend on integrating novel electromagnetic and mechanical co-design strategies, developing advanced conductive and dielectric materials that endure harsh conditions, and applying innovative manufacturing techniques. This presentation will explore the intersection of next-generation advanced manufacturing processes for 3D and multilayer geometries with the space environment's specific challenges to electronics and material compatibility.
Key topics will include the latest developments in 3D antennas and RF/photonic packaging, focusing on cutting-edge Advanced Manufacturing (AM) processes like micro-dispensing, two-photon polymerization, femtosecond laser machining, and aerosol jetting. These processes are essential for creating high-performance wireless hardware tailored for specialized low-volume space applications. The seminar will also cover aerospace-grade materials, highlighting their electromagnetic and mechanical properties to ensure space condition compatibility. Lastly, the talk will showcase practical examples of RF/photonic packaging and 3D conformal metasurface antennas, emphasizing their potential to transform space communications. Participants will leave with a deeper understanding of the future directions of wireless technologies in space.
Biography:
Eduardo Rojas obtained his M.S. and Ph.D. degrees in Electrical Engineering from the University of South Florida in 2014 and 2017, respectively. In 2017, he became an associate professor at Embry-Riddle Aeronautical University. His research focuses on microwave/millimeter-wave circuits, antenna applications through advanced manufacturing, wireless sensing in harsh environments, radio-frequency hardware security, and packaging for free-space optical communications devices. Rojas founded and co-directs the Wireless Devices and Electromagnetics Laboratory (WIDE Lab) at ERAU. His accolades include the 2019 National Science Foundation CAREER Award, the 2022 Jet Propulsion Laboratory Faculty Fellowship, the 2020 Most Promising Engineer Award in the Ph.D. and Education category from the Great Minds in STEM organization, and the 2021 Abas Sivjee Outstanding Research Award from ERAU. He is a Senior National Academy of Inventors member, with over 50 peer-reviewed publications and 8 U.S. patents. Rojas serves on IEEE MTT-S Technical Committees 4, 26, and 29 and the RTCA SC-236 committee, which sets standards for the Wireless Avionics Intra-Communication System (WAIC) within the 4200-4400 MHz range. He was the general conference chair for the 2022 IEEE Wireless and Microwave Technology Conference (WAMICON). He will chair the 12th Annual IEEE International Conference on Wireless for Space and Extreme Environments (WISEE 2024) and the 14th IEEE International Conference on RFID Technology and Applications.
Address:Department of Electrical & Computer Engineering , Embry-Riddle Aeronautical University