Monolithic, Heterogeneous and Hybrid Photonic Integration – There is a role for all

#Photonics #Electronic #Integrated #Circuits #(EICs) #Quantum #PICs #WIE
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The IEEE Photonics DL Talk is co-sponsored by the North Jersey Section PHO, AP/MTT, ED/CAS Chapters, and the IEEE North Jersey Section SIGHT and IEEE R1 WiE.

 

 

 

 

 

Photonic integration has been at the center of photonic activity for several years. Over this period, great strides have been made to increase the integration density and chip functionality. This talk will work its way up from the drivers for photonic integration – why do we need Photonic Integrated Circuits (PICs)? What are their similarities and differences with Electronic Integrated Circuits (EICs)? This analysis of integration drivers will lead to a discussion of recent progress on the main paths: monolithic, heterogeneous, and hybrid. The talk will conclude with possible approaches to meet the additional demanding considerations for future Quantum PICs.

 

 


  Date and Time

  Location

  Hosts

  Registration


  • Date: 25 Sep 2024
  • Time: 06:00 PM to 07:30 PM
  • All times are (GMT-05:00) US/Eastern
  • Add_To_Calendar_icon Add Event to Calendar
  • Fairleigh Dickinson University
  • 1000 River Rd.
  • Teaneck, New Jersey
  • United States 07666
  • Building: Muscarellel
  • Room Number: M105
  • Contact Event Hosts

  • Ajay Poddar (akpoddar@ieee.org), Naresh Chand (chandnaresh@gmail.com), Alfredo Tan (tan@fdu.edu), Durga Misra (durgamadhab.misra@njit.edu), Hong Zhao (zhao@fdu.edu), Anisha Apte (anisha_apte@ieee.org)

     

     

     

  • Co-sponsored by IEEE PHOTONICS Society DL Talk co-sponsored by IEEE North Jersey Section
  • Starts 01 August 2024 10:00 PM
  • Ends 25 September 2024 05:00 PM
  • All times are (GMT-05:00) US/Eastern
  • No Admission Charge

  Speakers

Dr. Daniel Renner

Topic:

Monolithic, Heterogeneous and Hybrid Photonic Integration – There is a role for all

Photonic integration has been at the center of photonic activity for several years. Over this period, great strides have been made to increase the integration density and chip functionality. This talk will work its way up from the drivers for photonic integration – why do we need Photonic Integrated Circuits (PICs)? What are their similarities and differences with Electronic Integrated Circuits (EICs)? This analysis of integration drivers will lead to a discussion of recent progress on the main paths: monolithic, heterogeneous, and hybrid. The talk will conclude with possible approaches to meet the additional demanding considerations for future Quantum PICs.

 

 

 

Biography:

Daniel Renner grew up in southern Chile, in South America. He received his Bachelor of Engineering Degree from the Universidad de Chile, and then, in his early twenties, he went to the University of Cambridge in England to do a Ph.D. in optoelectronics, a new field of studies at the time. Now, decades later, he has lived through various experiences related to the research, development, manufacturing, and commercialization of complex photonic devices and systems used in communication, sensor, and industrial applications. In the past 30 years, Daniel has been directly involved with the growth of four photonic start-ups in the United States: Ortel Corporation, Agility Communications, Aerius Photonics, and Freedom Photonics. This gives him a unique perspective on the workings of a high-tech small business. Daniel is currently the Chair of the IEEE Photonics Society Industry Engagement Committee, trying to help other small photonic businesses.

 

Email:




Agenda

Registration for the event and refreshments/dinner are complimentary.

Venue:

Fairleigh Dickinson University

1000 River Road,  Building: Muscarelle Center, Room Number: 105

Teaneck, New Jersey, United States 07666

For additional information about the venue and parking, please contact

Dr. Hong Zhao 

zhao@fdu.edu