Introduction to Semiconductor Molding
Introduction to Semiconductor Molding
Chris Masuyama
Business Development Manager,
TOWA USA Corporation
Abstract: Molding technology started from early 1980s and developed to super advanced technology for generative AI server with large size Chiplet. The basic of mold technology is to melt resin and formulate the shape to finalize chip making process, but there are many process parameters to consider in two different approaches. This approach is the foundation of new emerging mold technologies including heterogenous integration, hybrid bonding, 2.5D and 3D packaging for wafer/panel level process. Through this presentation, basic knowledge of molding process will be discussed and provide foundation for molding technologies with different technologies.
Pizza Lunch and Networking: 12 noon to 1 pm, CESTM Rotunda
Date and Time
Location
Hosts
Registration
- Date: 22 Aug 2024
- Time: 01:00 PM to 02:00 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
-
Add Event to Calendar
- 257 Fuller Road
- Albany, New York
- United States 12203
- Building: CESTM Auditorium
- Contact Event Host
- Co-sponsored by IBM
- Starts 13 August 2024 12:00 AM
- Ends 22 August 2024 02:00 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
- No Admission Charge
Speakers
Chris Masuyama of TOWA USA Corporation
Introduction to Semiconductor Molding
Abstract: Molding technology started from early 1980s and developed to super advanced technology for generative AI server with large size Chiplet. The basic of mold technology is to melt resin and formulate the shape to finalize chip making process, but there are many process parameters to consider in two different approaches. This approach is the foundation of new emerging mold technologies including heterogenous integration, hybrid bonding, 2.5D and 3D packaging for wafer/panel level process. Through this presentation, basic knowledge of molding process will be discussed and provide foundation for molding technologies with different technologies.
Biography:
Chris Masuyama is new business development manager at TOWA USA Corporation. He is responsible for new business development with wide range of customers and creating new process capabilities with business structures for not only semicoductor equipment but also other core businesses groups at TOWA.
Address:257 Fuller Road, `, Albany, 12203
