Introduction to Signal Integrity Course

#Signal #Integrity #MTT #EMC #packaging #FFT #WIE
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Whether you’re working with 32G or 400G technologies, this course is designed by industry experts to cover essential signal integrity fundamentals  and bridge the gap between theory and practical application.

Modules
• Advanced packaging technologies and high-speed applications
• Frequency and time domain signals
• Network parameters and application to broadband applications
• Fundamentals of EM and applications to package and PCB
• Hands on training on 3D modeling software
• High-speed measurements (Calibration, post processing…)
• Introduction to system sims (IBIS-AMI, eye…)

• Format: 6 sessions run bi-weekly starting Sep 9th, 2024, during lunch break*
• *FREE Lunch and refreshment.
• Location: HUB 350 Kanata tech park
• Certificate: IEEE CEU, PDH

 

Additional 25% discount will be applied for early registration

Non members 100 CAD
IEEE Member 60 CAD
AP-S/MMT-S 40 CAD
IEEE Volunteers FREE
Student FREE
Audit (no-certificate) FREE

To obtain certificate you will need to attend 80% of the sessions and complete the course assignment

https://r7.ieee.org/ottawa-aps-mtts/courses/



  Date and Time

  Location

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  Registration



  • Date: 09 Sep 2024
  • Time: 12:00 PM to 01:30 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
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  • Starts 25 August 2024 12:00 AM
  • Ends 09 September 2024 12:00 AM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
  • 1 in-person space left!
  • Admission fee ?


  Speakers

Dr. Sameh Y. Elnaggar

Biography:

Sameh Y. Elnaggar is a Senior Staff Engineer at Semtech Canada Corp, with over 15 years of experience spanning both academia and industry. He earned his Ph.D. in Electrical and Computer Engineering from the University of New Brunswick in Fredericton, NB. His research interests are diverse and include Wireless Power Transfer, Time/Spacetime Periodic Metamaterials, Signal Integrity, Computational Electrodynamics, and the Education of Engineering Electromagnetics. Sameh is also passionate about exploring the Mathematical Foundations of Electrical Engineering.

Dr. Ahmed Abdellatif

Biography:

Ahmed Abdellatif is a seasoned engineer with 15 years of expertise in electromagnetic (EM) systems, circuit, and systems design. Currently based in Ottawa, Ahmed's career spans various high-impact roles in companies like Microchip, Huawei Technologies, and Semtech Corporation, where he has led advanced projects in IC packaging, PCB design, and RF systems. His work has contributed to cutting-edge technologies, including data center solutions, 6G, and E-band phased array systems.

Ahmed holds a Ph.D. in Electrical and Computer Engineering from the University of Waterloo, where his research focused on high-performance integrated beam-steering techniques for millimeter-wave systems. With a deep understanding of RF measurement techniques and micro-fabrication, he has published over 30 conference papers, authored 7 journal papers, and holds 5 patents.


Dr. Laila Salman

Biography:

Laila Salman is a Principal Application Engineer at Ansys Canada, where she specializes in high-frequency electromagnetics. She has extensive expertise in areas such as RF microwave applications, antenna design, 5G and millimeter-wave technologies, automotive radar, and IoT applications.

Dr. Salman holds a Ph.D. in electromagnetic and antenna design from the University of Mississippi, USA. She has also conducted post-doctoral research at Université de Québec en Outaouais in Canada, focusing on dielectric resonator antennas, wearable antennas, microwave imaging, and metamaterials. Dr. Salman joined Ansys in 2010 and has been instrumental in advancing Ansys HFSS technology, particularly in the development of Mesh Fusion technology.

Dr Syed. A. Bokhari

Biography:

Syed. A. Bokhari received the BE degree in Electronics Engineering from the Visveswaraya College of Engineering of Bangalore University, The M.Sc.(Eng.) degree in Electrical Communication Engineering from the Indian Institute of Science (IISc), Bangalore, India and the Ph.D. degree from the Department of Aerospace Engineering, IISc.

He is currently a Signal Integrity and EMC Architect at Fidus Systems Inc., Ottawa, Canada. Prior to this, he has held positions of Senior Member of Consulting Staff at Cadence Design Systems (Canada) Ltd., Senior Research Associate at the Department of Electrical Engineering, University of Ottawa, Research Associate at the Laboratory of Electromagnetism and Acoustics of the Swiss Federal Institute of Technology in Lausanne, Switzerland, and Senior Research Fellow at IISc. He was the Technical Papers Co-Chair of the 2016 IEEE EMC Symposium in Ottawa and is the chairman of the IEEE Ottawa EMC Chapter. He received the Outstanding Paper Award in Signal

Integrity at EDICON 2017 in Boston. His areas of research interests include Printed Circuit Board design for Signal and Power Integrity, and EMC, and Miniaturized Antennas. He has many publications in these areas and holds two patents.


Cristian Filip

Biography:

Cristian Filip joined Intel of Canada in 2022 where he is a Hardware Platform Lead specializing in Signal Integrity of cutting-edge hardware for AI and graphics related applications. Prior to this, he has held positions of Senior Product Architect high-speed products at Mentor Graphics Corporation (acquired by Siemens) and Senior Hardware Engineer at General Dynamics Canada.

 

Cristian holds a M. Eng. In Electronics and Telecommunications from the Polytechnic University, Timisoara, Romania and is member of Professional Engineers Ontario. He has authored and co-authored several articles and papers and won the DesignCon Best Paper Award in 2016 and 2018 respectively.