Towards Monolithic Mobile Ultrasound Imaging System for Medical and Drone Applications

#microelectronics #circuits #medical #imaging
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Ultrasound Imaging System (UIS) has been widely used in medical imaging with its non-invasive, non-destructive monitoring nature; but so far the UIS has large form factor, making it difficult to integrate in mobile form factor. For drone and robotic vision and navigation, low-power 3-D depth sensing with robust operations against strong/weak light and various weather conditions is crucial. CMOS image sensor (CIS) and light detection and ranging (LiDAR) can provide high-fidelity imaging. However, CIS lacks depth sensing and has difficulty in low light conditions. LiDAR is expensive with issues of dealing with strong direct interference sources. UIS, on the other hand, is robust in various weather and light conditions and is cost-effective. However, in air channel, it often suffers from long image reconstruction latency and low framerate.

 

To address these issues, this talk introduces UIS ASICs for medical and drone applications. The medical UIS ASIC is designed to transmit pulse and receive echo through a 36-channel 2-D piezoelectric Micromachined Ultrasound Transducer (pMUT) array. The 36-channel ASIC integrates a transmitter (TX), a receiver (RX), and an analog-to-digital converter (ADC) within the 250- μm pitch channel while consuming low-power and supporting calibration to compensate for the process variation of the pMUT. With its small form factor, Intervascular Ultrasound (IVUS) and Intracardiac Echocardiography (ICE) becomes a viable application. The ASIC in 0.18- μm 1P6M Standard CMOS is verified with both electrical and acoustic experiments with a 6×6 pMUT array. Also, the ASIC for drone applications generates 28 Vpp pulses in standard CMOS and the digital back-end (DBE) achieves 9.83M-FocalPoint/s throughput to effectively translate real-time 3-D image streaming at 24 frames/s. With an 8×8 bulk piezo transducer array, the UIS ASIC is installed on an entry-level consumer drone to demonstrate 7-m range detection while the drone is flying. The talk will conclude with interesting research directions lying ahead in UIS.



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  • Date: 06 Sep 2024
  • Time: 10:30 AM to 12:00 PM
  • All times are (UTC+02:00) Bern
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  • Gloriastrasse 35
  • Zurich, Switzerland
  • Switzerland 8092
  • Building: ETZ building
  • Room Number: E8

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  Speakers

Prof. Jerald Yoo of Seoul National University

Biography:

Jerald Yoo (S’05-M’10-SM’15) received the B.S., M.S., and Ph.D. degrees in Department of Electrical Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2002, 2007, and 2010, respectively.


    
From 2010 to 2016, he was with the Department of Electrical Engineering and Computer Science, Masdar Institute, Abu Dhabi, United Arab Emirates, where he was an Associate Professor. From 2010 to 2011, he was also with the Microsystems Technology Laboratories (MTL), Massachusetts Institute of Technology (MIT) as a visiting scholar. Between 2017 and 2024, he was with the Department of Electrical and Computer Engineering, National University of Singapore, Singapore, as an Associate Professor. Since 2024, he has been with the Department of Electrical and Computer Engineering, Seoul National University, where he is currently an Associate Professor. He has pioneered research on Body-Area Network (BAN) transceivers for communication/powering and wearable body sensor network using the planar-fashionable circuit board for a continuous health monitoring system. He authored book chapters in Biomedical CMOS ICs (Springer, 2010), Enabling the Internet of Things—From Circuits to Networks (Springer, 2017), The IoT Physical Layer (Chapter 8, Springer, 2019) and Handbook of Biochips (Biphasic Current Stimulator for Retinal Prosthesis, Springer, 2021). His current research interests include low-energy circuit technology for wearable bio-signal sensors, flexible circuit board platform, BAN for communication and powering, ASIC for piezoelectric Micromachined Ultrasonic Transducers (pMUT), and System-on-Chip (SoC) design to system realization for wearable healthcare applications.

 

Dr. Yoo is an IEEE Solid-State Circuits Society (SSCS) Distinguished Lecturer (2024-2025 and 2017-2018). He also served an IEEE Circuits and Systems Society (CASS) Distinguished Lecturer (2019-2021). He is the recipient or a co-recipient of several awards: IEEE International Solid-State Circuits Conference (ISSCC) 2020 and 2022 Demonstration Session Award (Certificate of Recognition), IEEE International Symposium on Circuits and Systems (ISCAS) 2015 Best Paper Award (BioCAS Track), ISCAS 2015 Runner-Up Best Student Paper Award, the Masdar Institute Best Research Award in 2015 and the IEEE Asian Solid-State Circuits Conference (A-SSCC) Outstanding Design Award (2005). He was the founding vice-chair of the IEEE SSCS United Arab Emirates (UAE) Chapter and is the chair of the IEEE SSCS Singapore Chapter. He serves/has served as a Technical Program Committee Member of the IEEE International Solid-State Circuits Conference (ISSCC), ISSCC Student Research Preview (chair), IEEE Custom Integrated Circuits Conference (CICC, Emerging Technologies Subcommittee Chair), and IEEE Asian Solid-State Circuits Conference (A-SSCC, Emerging Technologies and Applications Subcommittee Chair). He is also an Analog Signal Processing Technical Committee Member of IEEE Circuits and Systems Society, an Steering Committee Member and an Associate Editor of IEEE Transactions on Biomedical Circuits and Systems (TBioCAS) as well as an Associate Editor of IEEE Open Journal of Solid-State Circuits Society (OJ-SSCS). He is a senior member of IEEE.