IEEE USA - Packaging Chips With CHIPS
WHEN: 17 October 2024
WHERE: Scottsdale, Arizona
REGISTRATION: https://chips.ieeeusa.org/pcwc-2024/registration/
There is a great semiconductor event coming up in Scottsdale Arizona on October 17th - Packaging Chips with CHIPS: West Coast Summit.
Registration is now open for the in-person event being held at Skysong - The Arizona State University’s Scottsdale Innovation Center. This one day summit will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the West Coast. We’ll be bringing together thought leaders from chip design and packaging companies, along with government policy makers, to discuss the industry in light of the historic CHIPS Act and the Materials-to-Fab Center coming to Arizona State University.
To find out more or to sign up today, visit the website at: https://chips.ieeeusa.org/pcwc-2024/
If you have any questions about the Summit or would like to find out how to get your company involved with this event, please contact IEEE-USA’s Melissa Carl at m.carl@ieee.org.
Look forward to seeing you in Scottsdale!
Date and Time
Location
Hosts
Registration
- Date: 17 Oct 2024
- Time: 03:00 PM UTC to 12:01 AM UTC
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Add Event to Calendar
- 1475 North Scottsdale Road
- Scottsdale , Arizona
- United States 85257
- Building: Skysong 1
- Contact Event Host
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Melissa Carl at m.carl@ieee.org