4th Annual IEEE Midwest PCB Fest 2024 Four Part Series - Part 2

#PCB #Signal #Integrity #Power #EMC/EMI
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Power Integrity for High-Speed Designs



  Date and Time

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  • Date: 16 Oct 2024
  • Time: 04:00 PM to 05:00 PM
  • All times are (UTC-05:00) Central Time (US & Canada)
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  • Starts 03 October 2024 03:56 PM
  • Ends 16 October 2024 06:00 AM
  • All times are (UTC-05:00) Central Time (US & Canada)
  • No Admission Charge


  Speakers

Benjamin Dannan

Topic:

Elevate Your Power Integrity Measurements: Analyzing Large Signal Phenomena and Crosstalk in Time & Frequency domain and

Elevate Your Power Integrity Measurements: Analyzing Large Signal Phenomena and Crosstalk in Time & Frequency domain and avoiding Ground Loops Effects

Biography:

Benjamin Dannan is the Founder and Chief Technologist at Signal Edge Solutions. Benjamin Dannan is an experienced signal and power integrity (SI/PI) design consultant developing advanced packaging solutions for high-performance ASICs, chiplets, and complex FPGA designs. He is a Keysight ADS Certified Expert with expert-level proficiency in high-speed simulation solutions and multiple 3D EM solutions. He has expert-level proficiency with multiple test and measurement solutions, including oscilloscopes, vector network analyzers (VNA), Time Domain Reflectometers (TDRs), function generators, and EMC lab testing equipment.

 

He is a senior member of IEEE with a multi-faceted background that includes a wide range of professional engineering and military experiences. His engineering experience includes designing, developing, and launching production products, including ASICs, radars, fully autonomous robotic platforms, pan-tilt-zoom (PTZ) camera video systems, and ground combat vehicles.

 

He is a specialist in signal and power integrity concepts, high-speed circuits, and multi-layered PCB design, as well as has multiple years of experience with EMC product development and certifications to support global product launches. Additionally, he has extensive experience with Chip-Package-PCB-VRM power delivery network (PDN) principles.

 

His depth of expertise includes modeling large SoC designs, multi-chip modules (MCMs), and chiplets with frequencies in excess of multiple GHz using innovative technologies. He has multiple years of experience leading multiple products through EMC/EMI compliance testing activities for global market sales, including CE, FCC, IEC, CISPR, and other regulations. In addition to his experience and knowledge solving EMC non-compliance issues.

 

Benjamin holds a certification in cybersecurity, has a BSEE from Purdue University, a Master of Engineering in Electrical Engineering from The Pennsylvania State University, and graduated from the USAF Undergraduate Combat Systems Officer training school with an aeronautical rating. Benjamin is a trained Electronic Warfare Officer in the USAF with deployments on the EC-130J Commando Solo in Afghanistan and Iraq, totaling 47 combat missions, and a trained USAF Cyber Operations Officer. In addition, he has co-authored multiple peer-reviewed journal publications and has twice received the prestigious DesignCon best paper award, given to authors who are leading practitioners in semiconductor and electronic design.

 

Benjamin Dannan