Introduction to Signal Integrity Course- Session 3
Modules
• Advanced packaging technologies and high-speed applications
• Frequency and time domain signals
• Network parameters and application to broadband applications
• Fundamentals of EM and applications to package and PCB
• Hands on training on 3D modeling software
• High-speed measurements (Calibration, post processing…)
• Introduction to system sims (IBIS-AMI, eye…)
• Format: 6 sessions run bi-weekly starting Sep 9th, 2024, during lunch break*
• *FREE Lunch and refreshment.
• Location: HUB 350 Kanata tech park
• Certificate: IEEE CEU, PDH
This link is for late registration ONLY. If you have already registered once (in the first session), PLEASE DO NOT REGISTER AGAIN. Refunding is a complex process
Date and Time
Location
Hosts
Registration
- Date: 07 Oct 2024
- Time: 12:00 PM to 01:30 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
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- 350 Legget Dr
- Ottawa, Ontario
- Canada
- Building: HUB 350
- Starts 03 October 2024 12:00 AM
- Ends 07 October 2024 12:00 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
- Admission fee ?
Speakers
Sameh Y. Elnaggar
Biography:
Sameh Y. Elnaggar is a Senior Staff Engineer at Semtech Canada Corp, with over 15 years of experience spanning both academia and industry. He earned his Ph.D. in Electrical and Computer Engineering from the University of New Brunswick in Fredericton, NB. His research interests are diverse and include Wireless Power Transfer, Time/Spacetime Periodic Metamaterials, Signal Integrity, Computational Electrodynamics, and the Education of Engineering Electromagnetics. Sameh is also passionate about exploring the Mathematical Foundations of Electrical Engineering.
Cristian Filip
Biography:
Cristian Filip joined Intel of Canada in 2022 where he is a Hardware Platform Lead specializing in Signal Integrity of cutting-edge hardware for AI and graphics related applications. Prior to this, he has held positions of Senior Product Architect high-speed products at Mentor Graphics Corporation (acquired by Siemens) and Senior Hardware Engineer at General Dynamics Canada.
Cristian holds a M. Eng. In Electronics and Telecommunications from the Polytechnic University, Timisoara, Romania and is member of Professional Engineers Ontario. He has authored and co-authored several articles and papers and won the DesignCon Best Paper Award in 2016 and 2018 respectively.