Chemical Mechanical Planarization (CMP) for Hybrid Bonding
Chemical Mechanical Planarization (CMP) for Hybrid Bonding
This invited talk will delve into the intricate process of Chemical Mechanical Polishing (CMP) and its pivotal role in Hybrid Bonding (HB) within semiconductor manufacturing. CMP is a sophisticated technique that leverages both chemical and mechanical forces to achieve film planarization. The discussion will highlight the critical importance of CMP in HB, particularly in attaining precise control over dishing and surface roughness. The key challenges associated with CMP for HB will be addressed, such as defectivity, dishing, and loading, and present strategies for addressing them to ensure optimal outcomes. Furthermore, the session will highlight the necessity of co-optimizing CMP processes for HB, emphasizing its implications in in the ever-evolving field of semiconductor manufacturing and advanced packaging.
IMPORTANT NOTE: If you are not a US citizen or a permanent resident OR have not received an NYCREATES site clearance in the last 12 months, please register by 15th October so your site clearance can be approved before the event date.
Date and Time
Location
Hosts
Registration
- Date: 29 Oct 2024
- Time: 12:00 PM to 02:00 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
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- 255 Fuller Rd
- Albany, New York
- United States 12203
- Building: CESTM
- Room Number: CESTM auditorium
- Starts 11 October 2024 12:00 AM
- Ends 29 October 2024 02:00 PM
- All times are (UTC-04:00) Eastern Time (US & Canada)
- No Admission Charge
Speakers
Swetha Barkam
Chemical Mechanical Planarization (CMP) for Hybrid Bonding
Biography:
Dr. Swetha Barkam is a Product Manager at Applied Materials’ CMP Business Unit. She received her undergrad in Materials Science and Engineering from Indian Institute of Technology Kanpur (IITK), PhD from University of Central Florida (UCF) and has published over 14 papers and filed numerous patents. Currently, she focuses on developing products for Chemical Mechanical Planarization (CMP), aimed at 3D Heterogenous Integration and wafer level packaging.
