Introduction to Signal Integrity Course- Session 4

#IEEEDay #telecommunication #emc #signal#integrity
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Modules
• Advanced packaging technologies and high-speed applications
• Frequency and time domain signals
• Network parameters and application to broadband applications
• Fundamentals of EM and applications to package and PCB
• Hands on training on 3D modeling software
• High-speed measurements (Calibration, post processing…)
• Introduction to system sims (IBIS-AMI, eye…)

• Format: 6 sessions run bi-weekly starting Sep 9th, 2024, during lunch break*
• *FREE Lunch and refreshment.
• Location: HUB 350 Kanata tech park
• Certificate: IEEE CEU, PDH

This link is for late registration AUDIT ONLY 



  Date and Time

  Location

  Hosts

  Registration



  • Date: 21 Oct 2024
  • Time: 12:00 PM to 01:30 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
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  • 350 Legget Dr
  • Ottawa, Ontario
  • Canada
  • Building: HUB 350

  • Contact Event Hosts
  • Starts 19 October 2024 12:00 AM
  • Ends 21 October 2024 12:00 PM
  • All times are (UTC-04:00) Eastern Time (US & Canada)
  • No Admission Charge


  Speakers

Dr Syed. A. Bokhari

Biography:

Syed. A. Bokhari received the BE degree in Electronics Engineering from the Visveswaraya College of Engineering of Bangalore University, The M.Sc.(Eng.) degree in Electrical Communication Engineering from the Indian Institute of Science (IISc), Bangalore, India and the Ph.D. degree from the Department of Aerospace Engineering, IISc.

He is currently a Signal Integrity and EMC Architect at Fidus Systems Inc., Ottawa, Canada. Prior to this, he has held positions of Senior Member of Consulting Staff at Cadence Design Systems (Canada) Ltd., Senior Research Associate at the Department of Electrical Engineering, University of Ottawa, Research Associate at the Laboratory of Electromagnetism and Acoustics of the Swiss Federal Institute of Technology in Lausanne, Switzerland, and Senior Research Fellow at IISc. He was the Technical Papers Co-Chair of the 2016 IEEE EMC Symposium in Ottawa and is the chairman of the IEEE Ottawa EMC Chapter. He received the Outstanding Paper Award in Signal

Integrity at EDICON 2017 in Boston. His areas of research interests include Printed Circuit Board design for Signal and Power Integrity, and EMC, and Miniaturized Antennas. He has many publications in these areas and holds two patents.