IEEE EPS-Technical Presentation
Title: Advanced Packaging and Integration: Unleashing the Full Potential of Wide-Bandgap Semiconductors.
Abstract:
The projected growth of renewable energy resources, electric transportation systems, high-performance computing and AI are creating high demand for power electronics with improved efficiency, power density, and reliability. Wide-bandgap (WBG) power semiconductors enable power electronics to meet these growing demands due to their faster switching speeds, higher voltage ratings, lower conduction losses, and higher operating temperatures. However, standard packaging technologies result in WBG devices being derated and slowed down. New packaging technologies with low inductance, improved insulation, reduced thermal resistance, and high temperature reliability are essential to unleashing the full potential of WBG devices. Several applications, such as electric vehicles, have begun to implement advanced packaging materials and technologies to boost performance and provide a competitive edge. This presentation will review the challenges associated with packaging WBG power semiconductors, advanced packaging trends in industry, and opportunities offered by advanced packaging technologies and integration strategies.
Date and Time
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- Date: 19 Nov 2024
- Time: 02:00 PM to 03:00 PM
- All times are (UTC-06:00) Central Time (US & Canada)
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- Co-sponsored by Rajen Murigan
- Starts 16 November 2024 12:00 AM
- Ends 19 November 2024 12:00 PM
- All times are (UTC-06:00) Central Time (US & Canada)
- No Admission Charge
Speakers
Christina of Virginia Tech in the Center for Power Electronics Systems
Advanced Packaging and Integration: Unleashing the Full Potential of Wide-Bandgap Semiconductors
The projected growth of renewable energy resources, electric transportation systems, high-performance computing and AI are creating high demand for power electronics with improved efficiency, power density, and reliability. Wide-bandgap (WBG) power semiconductors enable power electronics to meet these growing demands due to their faster switching speeds, higher voltage ratings, lower conduction losses, and higher operating temperatures. However, standard packaging technologies result in WBG devices being derated and slowed down. New packaging technologies with low inductance, improved insulation, reduced thermal resistance, and high temperature reliability are essential to unleashing the full potential of WBG devices. Several applications, such as electric vehicles, have begun to implement advanced packaging materials and technologies to boost performance and provide a competitive edge. This presentation will review the challenges associated with packaging WBG power semiconductors, advanced packaging trends in industry, and opportunities offered by advanced packaging technologies and integration strategies.
Biography:
Christina DiMarino is an assistant professor at Virginia Tech in the Center for Power Electronics Systems (CPES). She received her M.S. and Ph.D. degrees in electrical engineering from Virginia Tech in the USA in 2014 and 2018, respectively. Her research interests include power electronics packaging and high-density integration of wide- and ultra-wide bandgap power semiconductors and medium-voltage power modules. Dr. DiMarino currently serves as a member-at-Large for the IEEE Power Electronics Society (PELS), Chair of the PELS Technical Committee on Power Components, Integration, and Power ICs (TC2), Associate Editor for the IEEE Transactions on Power Electronics, and is a member of the PCIM Europe Advisory Board and the IEEE PELS Women in Engineering steering committee. She has received five best paper and presentation awards at international conferences, the Outstanding New Assistant Professor Award at Virginia Tech in 2022, and the IEEE PELS Richard M. Bass Outstanding Young Power Electronics Engineer Award in 2024.
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