RF to mm-Wave Front-End Technologies for Connected Future

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Future of communication and sensing network is being transformed with the advancement in next generations of wireless with beyond-5G, beyond-WiFi-8, VR/XR/Metaverse and other applications. Higher quality of experiences for connected future with ubiquitous lowest latency and superhigh data rate connectivity services will require innovative wireless technologies and communication hardware combined with AI/ML. Mobile platform integrated RF systems with antenna front ends are common factor for most of the wireless applications. Emerging usage scenarios will need intelligent mobile platforms with ultra-small form-factor, requiring co-design and heterogeneous integration of dis-similar semiconductor device, circuit and antenna technologies, in order to satisfy the desired application-specific performance criteria. 
This presentation will focus on the antenna-integrated RF to mm-wave/THz antenna/array integrated frontend opportunities and challenges demanding new technology, design, development and integration. Example architectures enabling multifunction microsystem platform will be discussed.



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  • Date: 20 Dec 2024
  • Time: 05:30 AM UTC to 07:00 AM UTC
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  • Webinar by Joint SBC NITM
    04:00 – 05:00 pm
    Time zone: Asia/Kolkata
    Google Meet joining info
    Video call link: https://meet.google.com/gwq-jukx-zfa

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  Speakers

Dr. Debabani Choudhury

Topic:

RF to mm-Wave Front-End Technologies for Connected Future

Future of communication and sensing network is being transformed with the advancement in next generations of wireless with beyond-5G, beyond-WiFi-8, VR/XR/Metaverse and other applications. Higher quality of experiences for connected future with ubiquitous lowest latency and superhigh data rate connectivity services will require innovative wireless technologies and communication hardware combined with AI/ML. Mobile platform integrated RF systems with antenna front ends are common factor for most of the wireless applications. Emerging usage scenarios will need intelligent mobile platforms with ultra-small form-factor, requiring co-design and heterogeneous integration of dis-similar semiconductor device, circuit and antenna technologies, in order to satisfy the desired application-specific performance criteria. 
This presentation will focus on the antenna-integrated RF to mm-wave/THz antenna/array integrated frontend opportunities and challenges demanding new technology, design, development and integration. Example architectures enabling multifunction microsystem platform will be discussed.

Biography:

Dr. Debabani Choudhury is the Founder and President of SeraTech in California, USA, working on cutting-edge GHz- to THz- technologies and system ingredients for future communication and sensing applications. She worked for 18+ years at Intel Labs as Senior Technologist and Research Director, spearheading the vision, strategy of GHz to sub-THz research and developments. Previously she worked at Hughes-Research/HRL Labs, Millitech and NASA Jet Propulsion Laboratories (JPL), where she developed many state-of-the-art millimeter-wave (mmWave)/terahertz (THz) technologies for space, defense, government, and automotive applications.
Dr. Choudhury is an IEEE Fellow with 100+ patents/patent applications and numerous publications. She received Intel’s Gordon Moore awards multiple times for excellence in research and also several NASA recognitions. 
Dr. Choudhury served on AP-S and MTT-S IEEE-Fellows Evaluation Committees (FEC). She served as Guest Editor for several IEEE transactions, journals, including the Proceedings of IEEE. She worked on multiple MTT-S Technical Coordination Committees and the Founding Co-Chair of TC-25 on Wireless Power. Dr. Choudhury served as the IEEE 5G-Initiative Committee member and initiated the MTT-S and ComSoc Collaboration for 5G Summits at IEEE IMS2017 as Chair. She is currently the MTT-S Future Directions Committee Vice-Chair and serves in the inter-society coordination committee. She is an elected ADCOM member for MTT-Society and currently IEEE TAB EIE member.

Address:California, United States





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