Ashwini of Ashwini KUmar Aggarwal

Abstract:

India is seeing the emergence of its Semiconductor Packaging sector. Current projects are focused on conventional packaging on the premise that they need to walk before they run.  This talk builds on the manufacturing process flow for a conventional packaging operation and then focuses on wafer dicing as a specific unit job role and discusses the nuances of the wafer dicing skill.

In this series of webinars, we are focusing on Semiconductor Packaging industry and the manufacturing Skills required for it.

This webinar invite - 2nd of the series - features invited industry speaker, Mr Prithvi Deep Singh, Director, Continental Devices India (P) Ltd (CDIL). CDIL is a pioneer in the Indian Semiconductor industry- and one of the first projects that have gone ahead with a Silicon-Carbide device packaging facility.

 The presentation will give an industry pioneers overview of his ATMP project - and the key factors determining the optimal yield, the equipment and the dicing process types with pros and cons.

The presentation is an outcome of the speaker's work as the Chair of the ISM Advisory group focusing on Manufacturing Skill Development for Semiconductor packaging and as a leader/SME in the semiconductor manufacturing skill committee at Electronics Sector Skill Council of India.

Biography:

Dr.Ashwini Aggarwal is currently Professor of Practice at Manav Rachna International Institute for Research Studies at Faridabad/Delhi NCR, an IEEE Senior Member, Founder Chair of the Delhi NCR Chapter of IEEE EPS (semiconductor packaging) & a Fellow of the Institute of Electronics and Telecom Engineers.

Dr Ashwini has over 40+ years of industry experience, has retired from Applied Materials (US MNC) in August'24. He is a consultant to Organization for Economic Cooperation and Development and to global MNC clients in the semiconductor/display/nano-technology space in his professional practise. He is also the chair of the semiconductor manufacturing NOS ( skill) committee at Electroniics Sector Skill Council and has contributed to the AICTE revised curriculum on the subject as a part of the advisory committee for semiconductor and VLSI stream.

Email:

Address:541 Sector 9, Faridabad, Faridabad, India, 121006

Mr Prithvi Deep Singh (Prithvi) is the Director, Continental Devices India Pvt Ltd - India's pioneering semiconductor company. He is the third generation at the helm of CDIL and is tasked with the new and strategic projects including the Silicon Carbide device projects.  CDIL's first line for semiconductor packaging went live in Sept'23 and its success is inevitably boosting expansion.

CDIL is a pioneer in the Indian Electronics sector, known for its expertise in producing semiconductor devices, including diodes, transistors, and other components essential for various electronics applications.

Prithvi has completed his BSc in Operations Research and Information Engineering from Cornell University, USA and specializes in Theory of Constraints (TOC) and Lean Manufacturing Principles.