Habib Hichri, Ph.D. of SUSS MicroTec Photonic Systems Inc.

The continuous trend in miniaturization, increasing performance and mobility of electronic devices drives not only the requirements of the chip itself, but also its package type. The current integration processes encompassing photolithography may be reaching their capability limits for providing cost effective and innovative package designs to meet the market’s most stringent requirements. In addition, there are significant challenges in these legacy processes that manufacturers will need to overcome.

In support of this technology trend and to address the current photolithography process integration challenges, we introduce excimer laser ablation as a direct patterning process that uses proven industrialized excimer laser sources to emit high-energy pulses at short wavelengths to remove materials. The combination of a high-power excimer laser source, large-field laser mask, and precision projection optics enables the accurate replication and placement of fine resolution circuit patterns without the need for any wet-processing. In addition, with excimer laser patterning technology the industry gains a much wider choice of dielectric materials (photo and non-photo) to help achieve further reductions in manufacturing costs as well as enhancements in chip or package performance.

In this presentation, we will address the capabilities of this novel alternative patterning solution in achieving different customer needs from dielectric ablation, metal spallation and seed layer removal. We will also propose a new process that uses excimer laser ablation to integrate via and RDL traces in one patterning process step, followed by seed layer deposition, plating and planarization processes. We will explain in detail the new proposed integration flow and further demonstrate its technical robustness and commercial advantages. We will also cover the capability of excimer laser ablation to extend the current material portfolio to non-photo materials and highlight its commercial benefits as compared to the current lithography based process of record (POR).

Biography:

Habib Hichri joined SUSS MicroTec on October 2013 as Engineering Applications Director in Corona CA, USA. Before joining SUSS MicroTec, Habib spend about 12 years with IBM Semiconductors Research and Development Center in East Fishkil, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management position within IBM on process development in lithography and Dry Reactive Ion Etch in the front end of line area for microprocessor fabrication. Habib holds over 32 U.S. patents and authored over 25 publications and presentations. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France and an MBA degree from the State University of New York at Buffalo.

Email:

Address:220 Klug Circle, , Corona, California, United States, 92880-5409