True silicon On-chip RF components for 5G and beyond applications

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Abstract:
Transferring the RF components like an antenna from its traditional off-chip
status to bring an on-chip component is an important development and brings
many advantages with itself such as cost and size, ease in integration, high
fabrication precision and repeatability, and no more 50-ohm matching
boundary. Due to the push toward 5G, 6G, and beyond antenna sizes have
dropped to the order of millimeters and thus are becoming compatible with
the typical chip dimensions. On the other hand, silicon (Si)-based
semiconductor  technologies, such as a complementary
metal-oxide-semiconductor (CMOS)  process, have come a long way, and thus,
high-frequency circuits and antennas  can be realized on a single chip
compactly. However, the size of the mm-wave antenna-on-chip (AoC) has
become compatible with the typical CMOS chip dimensions. However, the CMOS
stack-up is still not favorable for antenna-on-chip implementation. This
is mainly because of the very lossy Si-substrate that also has a very high
permittivity that limits the realization of an efficient on-chip antenna
compared to their off-chip counterparts.



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  • Date: 14 Feb 2025
  • Time: 10:30 AM UTC to 12:30 PM UTC
  • Add_To_Calendar_icon Add Event to Calendar
  • DA 214
  • IIT kanpur
  • Kanpur, Uttar Pradesh
  • India 208016
  • Building: ACES
  • Room Number: DA 214

  • Contact Event Host
  • Co-sponsored by IEEE AP-S SBC IIT Kanpur and IEEE MTT-S Uttar Pradesh Section Chapter


  Speakers

Dr. Akhtar of Technology Innovation Institute (TII), Abu Dhabi.

Topic:

True silicon On-chip RF components for 5G and beyond applications

Abstract:
Transferring the RF components like an antenna from its traditional off-chip
status to bring an on-chip component is an important development and brings
many advantages with itself such as cost and size, ease in integration, high
fabrication precision and repeatability, and no more 50-ohm matching
boundary. Due to the push toward 5G, 6G, and beyond antenna sizes have
dropped to the order of millimeters and thus are becoming compatible with
the typical chip dimensions. On the other hand, silicon (Si)-based
semiconductor  technologies, such as a complementary
metal-oxide-semiconductor (CMOS)  process, have come a long way, and thus,
high-frequency circuits and antennas  can be realized on a single chip
compactly. However, the size of the mm-wave antenna-on-chip (AoC) has
become compatible with the typical CMOS chip dimensions. However, the CMOS
stack-up is still not favorable for antenna-on-chip implementation. This
is mainly because of the very lossy Si-substrate that also has a very high
permittivity that limits the realization of an efficient on-chip antenna
compared to their off-chip counterparts.

Biography:

Speaker's Biography:
Dr. Zubair Akhter received a bachelor's degree in electronics and
instrumentation engineering from the Anand Engineering College, Agra, India,
in 2008, and an MTech. Degree in RF and microwave engineering from Indian
Institute of Technology Roorkee, Roorkee, India, in 2011. He obtained his
Ph.D. in Electrical Engineering from the Indian Institute of Technology,
Kanpur, India, in 2018, with a focus on microwave imaging, sensing, &
nondestructive testing of materials, through- wall imaging, and
ultra-wide-band antennas. He has recently joined Technology Innovation
Institute (TII), Abu Dhabi as a Senior Antenna Engineer. Prior to TII, he was
associated with King Abdullah University of Science and Technology (KAUST),
Saudi Arabia as a Postdoctoral fellow where he worked with the world's top
funding agencies such as Lockheed Martin Corporation, Ericsson, SABIC, and
Aramco for solving the applied industrial challenges. His research for
Lockheed Martin on "ultra-thin, dual-mode wideband circular microstrip
antennas for UAVs" was featured by the IEEE Open Journal of antennas and
Propagation. Before joining KAUST, he was associated with Abu Dhabi National
Oil Company (ADNOC) Gas Research Center (GRC) as a Research Engineer. His
current research interests are in on-chip antennas, microwave imaging,
non-destructive testing for the oil and gas industry, printed-flexible
electronics, printed transparent antennas, and Chipless RFID based sensing.
He has authored/co-authored over 65 international publications published in
top-notch peer-reviewed journals such as IEEE Transactions on Microwave
Theory and Techniques (MTT), IEEE Transactions on Antennas and Propagation,
IEEE Transactions on Instrumentation and Measurement, IEEE Sensors Journal,
and various admired international conferences. He is an inventor of 6 US
patents and has given 15 invited talks at various internationally recognized
forums/institutions. He is a member of IEEE and founding chair of the IEEE
Antennas and Propagation Student Branch Chapter (SBC), Indian Institute of
Technology, Kanpur, India. He is currently an editorial board member in
frontiers wearable electronics and served as a member of the Technical
Program Committee in IMaRC-2021 and MAPCON- 2022/2023. Dr. Akhter is a
recipient of the Early Career Researcher Teaching Award from the Office of
the Provost in collaboration with the Office of Vice President (Research) at
King Abdullah University of Science and Technology, KAUST.

Address:Technology Innovation Institute (TII), Abu Dhabi.,





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