Navigating the Heterogeneous Future of Microelectronics

#heterogeneous #integration #roadmap
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-- roadmap structure, development, applications to new technologies …

Given the increasing complexity of microelectronics and the need for increased performance, epitomized and brought into stark clarity by the increasing prevalence of AI, there is a need for maturing cohesive roadmaps.  In this talk, we will describe a vision for how roadmapping is structured, how we anticipate it to evolve, and how we can all participate in this evolution.

 

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  • Date: 20 Mar 2025
  • Time: 07:00 PM UTC to 08:00 PM UTC
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  • Starts 28 February 2025 08:00 AM UTC
  • Ends 20 March 2025 07:30 PM UTC
  • No Admission Charge

  Speakers

Ravi Mahajan of Intel

Biography:

Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding.  Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes including 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Ravi joined Intel in 1992 after earning his Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for Intel’s EMIB technology. His early insights have led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 “Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6, the 2020 Richard Chu ITherm Award and the 2020 ASME EPPD Excellence in Mechanics Award. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has long been associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE.  He was elected to the National Academy of Engineering in 2022 for contributions to advanced microelectronics packaging architectures and their thermal management.

Address:United States

Bill Chen of ASE

Biography:

William Chen (Bill) holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining ASE, he was Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. Bill is a past President of the IEEE Electronics Packaging Society. He has been elected a Fellow of IEEE and a Fellow of ASME. He received the ASME InterPACK Award in 2009.  In 2018, he received the IEEE Electronics Packaging Field Award, recognizing his contribution to electronic packaging, from research & development through industrialization. He received the IMAPS Daniel C. Hughes Jr Memorial Award in 2022. 
Bill chairs the Heterogeneous Integration Roadmap initiative, co-sponsored by three IEEE Societies (EPS, EDS & Photonics) together with SEMI & ASME EPPD. 

Address:United States