25 Years of Advancements in Thermomechanical Reliability: Focus on Interface Strength Characterization in Microelectronic Packaging

#packaging #thermal #chips #integration
Share

Thermomechanical reliability of semiconductor devices and their packaging represents a crucial aspect for process yield, selection and integration of new materials, and reliability during operation. The adhesion of interfaces and cohesion of layers represents one of the most important metrics for reliability. In this lecture Dr. Dauskardt will describe innovations over the last 25 years to reliably characterize and understand adhesion and related thermomechanical concepts relevant for semiconductor

1) FEOL and BEOL structures.

2) packaging materials and designs.


  Date and Time

  Location

  Hosts

  Registration


  • Date: 13 Mar 2025
  • Time: 04:30 PM UTC to 06:00 PM UTC
  • Add_To_Calendar_icon Add Event to Calendar
  • 257 Fuller Rd
  • Albany, New York
  • United States
  • Building: CESTM
  • Room Number: CESTM auditorium
  • Contact Event Host
  • Starts 06 March 2025 05:00 PM UTC
  • Ends 13 March 2025 09:00 PM UTC
  • No Admission Charge

  Speakers

Reinhold Dasukardt

Topic:

25 Years of Advancements in Thermomechanical Reliability:

Focus on Interface Strength Characterization in Microelectronics

 

Reinhold Dasukardt

Ruth G. and William K. Bowes Professor Materials Science, Mechanical Engineering and Surgery

Stanford University and the Stanford School of Medicine.

Biography:

Reinhold H. Dauskardt is the Ruth G. and William K. Bowes Professor of the Department of Materials Science and Engineering, the Department of Mechanical Engineering and the Department of Surgery in the Stanford School of Medicine. He is a Visiting Professor in the School of Materials Science at the Nanyang Technical University in Singapore.
He and his research group have worked extensively on integrating new hybrid materials into emerging device, nanoscience, and energy technologies and also on the biomechanical function and barrier properties of human skin and other soft tissues. He is an internationally recognized expert on spray plasma processing of functional thin-films, and on the reliability and damage processes in device technologies and soft tissues, specifically the biomechanics of human skin and regeneration processes in cutaneous wounds. He has won numerous awards including the Henry Maso Award from the Society of Cosmetic Chemists for fundamental contributions to skin science (2011), the IBM Shared University Research Award (2011), the Semiconductor Industry Association University Researcher Award (2010), an IBM Faculty Award (2006), the ASM International Silver Medal (2003), an Alexander von Humboldt Research Award (2002), and the U.S. Department of Energy Outstanding Scientific Accomplishment Award (1989).




Agenda

12:30 to 1 pizza lunch

1 to 2 PM presentation