EMC Society Philadelphia Chapter Meeting featuring Don Heirman, Speaker

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We will open our 2017-2018 season shortly!  SAVE THE DATE – Thursday, October 26, 2017

FIRST COME, FIRST SERVED.  

DETAILS:

  • Networking Time and Refreshments**:   5:30pm-6:00pm
  • Meeting / Presentations:   6:00pm – 7:15pm
    1. 6:00-6:45pm – Don Heirman
    2. 6:45-7:05pm – Sangam Baligar
  • Q&A Session:   directly after presentations

**A light dinner will be provided at no charge



  Date and Time

  Location

  Contact

  Registration


  • AR RF / Microwave Instrumentation
  • 160 School House Lane
  • Souderton, Pennsylvania
  • United States 18964-9990

Staticmap?size=250x200&sensor=false&zoom=14&markers=40.2777405%2c 75
  • Eileen Ambler

    ITEM Media

    610-382-5889

  • Co-sponsored by AR RF / Microwave Instrumentation
  • Registration closed


  Speakers

Donald Heirman, President

Donald Heirman, President of Don HEIRMAN Consultants

Topic:

Survey of basic and advance work of National and International EMC standards developers

Don will explore the EMC standards activity of these national and international standards development committeesto include: a) Survey of immunity and emission standards of the International Electrotechnical Commission, b) Status of a variety of EMC national standards produced by ANSI ASC C63, and c) Status of specific IEEE EMC Society standards being developed.  As time permits, an example of a recent C63 standard on validating emission test sites will be discussed The CISPR standards on emission and immunity testing will also be described.

Biography:

Donald Heirman is president of Don HEIRMAN Consultants, LLC, which is a training, standards, and educational electromagnetic compatibility (EMC) consultation corporation. Previously he was with Bell Laboratories for over 30 years in many EMC roles including Manager of Lucent Technologies (Bell Labs) Global Product Compliance Laboratory, which he founded, and where he was in charge of the Corporation’s major EMC and regulatory test facility and its participation in ANSI accredited standards and international EMC standardization committees. He chairs, or is a principal technical contributor to, US and international EMC standards organizations including ANSI ASC C63® (immediate past chairman and chairman of the C63.4 working group), the Institute of Electrical and Electronics Engineers, and immediate past chairman of the International Electrotechnical Commission’s (IEC) International Special Committee on Radio Interference (CISPR). He is the chairman of the IEC’s Advisory Committee on EMC (ACEC) starting in July 2013. He is also a member of the Technical Management Committee of the US National Committee of the IEC. In November 2008 he was presented with the prestigious IEC Lord Kelvin award at the IEC General Meeting in Sao Paulo, Brazil. This is the highest award in the IEC and recognizes Don’s many contributions to global electrotechnical standardization in the field of EMC. He is a life Fellow of the IEEE and an honored life member of the IEEE EMC Society and past member of its Board of Directors, chair of its technical committees on EMC measurements and Smart Grid, past Vice President for Standards, past EMCS president, and past chair of its standards development committee. He is also past president of the IEEE Standards Association (SA), past member of the SA Board of Governors and past member of the IEEE’s Board of Directors and Executive Committee. He now teaches the practical application of EMC compliance measurements at Purdue University, West Lafayette, Indiana. Currently he is a voting member of the US Smart Grid Interoperability Panel (SGIP - now called the Smart Electric Powered Alliance (SEPA)) and vice chairman of and its Testing and Certification Committee. In addition he chairs the SEPA Electromagnetic Interoperability Issues Working Group which is providing EMC recommendations for Smart Grid equipment and systems. He serves as the consultant on Smart Grid matters for the Conformity Assessment Section of the American Council of Independent Laboratories. He is a retired Commander in the US Navy.

Sangam Baligar, Applications Engineer

Sangam Baligar, Applications Engineer of AR RF / Microwave Instrumentation

Topic:

Future in Radiated Immunity Testing

Overview: Traditional radiated immunity testing, such as IEC61000-4-3 for commercial products, requires 1% steps from 80 MHz to 6GHz.  This can become time-consuming and costly, and cause bottlenecks in your test chamber. What if you could maintain compliance but test up to 10 times faster?  Utilizing improved dwell time efficiency, a breakthrough technology is now available to support RI testing. Invest 30 minutes to see how this new technology allows you to test multiple tones simultaneously and get your product to market faster. 

Biography:

Sangam Baligar is an Applications Engineer for AR RF/Microwave Instrumentation’s Radiated and Conducted Immunity Systems and test software. Sangam is actively involved in product and system design, development, compliance, Product safety and testing as well as worldwide sales and customer support.   Sangam has 8 years of extensive experience in aerospace, automotive, consumer electronics, and Information technology and customer service.