Power-Efficient Short-Reach Electrical Links for the AI Era
IEEE Solid–State Circuits Society Central Illinois Section Distinguished Lecture
Abstract:
Power-Efficient Short-Reach Electrical Links for the AI Era
Data center, compute, and AI applications continue to demand higher bandwidth from electrical interconnects. The volume of short-reach links (less than a few cm) has exploded to facilitate high-bandwidth data movement between compute engines and memory in the AI era. This massive growth will continue as the industry moves towards highly-parallelized die-to-die interfaces to support chiplet-based architectures. However, power efficiency in these links is of paramount importance to maintain reasonable power levels within a compute drawer. This talk will focus on trends and advancements in power-efficient short reach links that aim to maximize the shoreline bandwidth density. Multi-disciplinary approaches involving circuit innovations, architectural advancements, data signaling techniques, and packaging technologies are required to deliver linear bandwidth densities above 1 Tbps/mm at power efficiencies below 500 fJ/bit.
Speaker: Dr. Timothy (Tod) Dickson
Principal Research Scientist @ IBM T.J. Watson Research Center
This event is being hosted by the IEEE Solid State Circuits Society and IEEE Central Illinois Section.
PLEASE REGISTER IF ATTENDING:
This event is open to all IEEE Members, IEEE Students, IEEE Graduate Students, and UIUC students. The event is free to attend. You are invited to register and attend the technical presentation. Join us for the event, a light lunch (pizza/sandwich) will be provided.
BRINGING A GUEST?
If you plan to bring a guest, please indicate so when you register.
MEETING ROOM LOCATION:
University of Illinois, Urbana - Champaign
Coordinated Science Laboratory
Room Number: CSL B02 – Auditorium.
HOW TO ATTEND ONLINE:
This meeting's presentation will be streamed online using WebEx teleconferencing. See below for details on how to connect via phone or web.
ABOUT US:
The IEEE Central Illinois Section serves members and students in Champaign, Bloomington, Peoria, Springfield, Danville, Litchfield, Decatur, Quincy, and their surrounding areas. The IEEE Solid- State Circuits Society (SSCS) focuses on fabricated integrated circuit designs—in contrast to simulated circuits and analyzed models—for all applications using relevant materials and interconnections.
Date and Time
Location
Hosts
Registration
- Date: 25 Apr 2025
- Time: 04:00 PM UTC to 05:30 PM UTC
-
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- 1308 West Main St.
- University of Illinois Urbana - Champaign
- Urbana, Illinois
- United States 61801
- Building: Coordinated Science Laboratory
- Room Number: CSL B02 - Auditorium
- Starts 25 March 2025 05:00 AM UTC
- Ends 25 April 2025 05:00 PM UTC
- No Admission Charge
Speakers
Tod of IBM T.J. Watson Research Center
Power-Efficient Short-Reach Electrical Links for the AI Era
Data center, compute, and AI applications continue to demand higher bandwidth from electrical interconnects. The volume of short-reach links (less than a few cm) has exploded to facilitate high-bandwidth data movement between compute engines and memory in the AI era. This massive growth will continue as the industry moves towards highly-parallelized die-to-die interfaces to support chiplet-based architectures. However, power efficiency in these links is of paramount importance to maintain reasonable power levels within a compute drawer. This talk will focus on trends and advancements in power-efficient short reach links that aim to maximize the shoreline bandwidth density. Multi-disciplinary approaches involving circuit innovations, architectural advancements, data signaling techniques, and packaging technologies are required to deliver linear bandwidth densities above 1 Tbps/mm at power efficiencies below 500 fJ/bit.
Biography:
Timothy (Tod) Dickson received the BS and M.Eng. degrees from the University of Florida, and the Ph.D. degree from the University of Toronto. Since 2006 he has been with the IBM T.J. Watson Research Center in Yorktown Heights, NY where he is currently a Principal Research Scientist. His research is on circuits and architectures for power-efficient serial communication. He is also an Adjunct Professor at Columbia University in New York, NY.
Dr. Dickson has been an author or co-author of several papers that have received best paper awards, including the inaugural VLSI Circuits Symposium Best Student Paper Award in 2004, the IEEE Journal of Solid-State Circuits Best Paper in 2009, the ISSCC Beatrice Winner Award
in 2009, and the IEEE CICC Best Regular Paper Award in 2015 and Best Invited Paper Award in 2024. He served on the TPC of the IEEE CICC from 2017-2023 and was an Associate Editor of the IEEE Solid State Circuits Letters over the same time period. He is currently an Associate Editor of the IEEE Open Journal of the Solid State Circuits Society and IEEE SSCS Distinguished Lecturer. He is an IEEE Senior Member.