Dr. Banerjee

Modern integrated circuit technology has enabled a lot of applications in the mm-wave and sub-THz frequency range at a low cost and in a small form factor in emerging areas such as wireless communication and sensing. In this presentation, key challenges in mm-wave and sub-THz integrated circuit and system design for next generation high data rate wireless communication and high-resolution sensing will be discussed. To address the demand for high performance in these systems, it is becoming increasingly important to take a multidisciplinary approach such as digitally assisted RF circuits and heterogeneous co-integration of III-V and CMOS technologies. The power amplifier (PA) is one of the most critical blocks in the wireless transceiver and innovative PA architectures, which utilize such multidisciplinary techniques to improve the performance, will be discussed in this presentation. A digitally assisted and adaptive 74GHz stacked segmented PA in 22nm FD-SOI technology will be presented. Next, an InP based 130GHz PA will be presented that can take advantage of III-V and CMOS co-integration. Possible approaches for co-integrating CMOS and III-V technology will be shown. Finally, future directions and research opportunities will be discussed.

Biography:

Aritra Banerjee received the B.E. degree in Electronics and Telecommunication Engineering from Jadavpur University, Kolkata, India, in 2009, and the M.S. and Ph.D. degrees in Electrical and Computer Engineering from Georgia Institute of Technology, Atlanta, GA, USA, in 2011 and 2013, respectively. He is currently a professor in the Department of Electrical and Computer Engineering at University of Illinois Chicago. His research interests include analog, RF, mm-wave, and THz integrated circuits and systems for applications such as next generation wireless communication and radar-based sensing. From 2013 to 2017, he was an Analog Design Engineer with Texas Instruments, Dallas, TX, USA, where he worked in the Kilby Labs research center and the Wireless Infrastructure group, focusing on the design of switch-mode CMOS RF power amplifiers, high performance VCOs, and integrated RF transceivers. From 2017 to 2022 he was with imec, Kissimmee, FL, USA, focusing on RF and mm-wave IC design for radar and high data rate wireless communication transceivers. He has authored or coauthored over 50 papers in refereed international journals and conferences and has 5 granted US patents. Dr. Banerjee was a member of the Technical Program Committee (TPC) of the IEEE Custom Integrated Circuits Conference (CICC) and in CICC 2023 and CICC 2024 he served as the co-chair and chair of the wireless sub-committee, respectively. He is also a TPC member of IEEE Radio Frequency Integrated Circuits Symposium (RFIC). He was a recipient of the IEEE Microwave Theory and Techniques Society Graduate Fellowship in 2012.