Network Analyzer Applications for 224Gbps and 6G

#WIE #6G #224Gbps #connector #measurements #datacenter #AI
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Join us for a quick introduction o high speed applications and demo on ZNA usage for Samtec 224Gbps new connector board as well as application of the D-band modules.

This seminar provides an overview of high-speed measurement best practices with a focus on network analyzer applications in next-generation interconnects and SerDes characterization. We will discuss key considerations for making accurate S-parameter measurements, calibration techniques, fixture de-embedding, and time/frequency-domain correlation.

The session will include a live demonstration using the Rohde & Schwarz ZNA 110 GHz vector network analyzer and the Samtec 90 GHz BullsEye ISI Test Board, showcasing practical measurement workflows for broadband interconnects and evaluating channel performance in ultra-high-speed systems.

This event is ideal for engineers and researchers working in high-speed digital, RF/microwave, and packaging domains who are seeking hands-on insight into cutting-edge instrumentation and methodologies for 224 Gbps system design and validation.

Note: by registering to this event you consent sharing your contact information with R&S Canada



  Date and Time

  Location

  Hosts

  Registration



  • Date: 20 May 2025
  • Time: 07:30 PM UTC to 09:00 PM UTC
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  • 350 Legget Dr.
  • Kanata, Ontario
  • Canada
  • Building: HUB 350

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  • Starts 01 May 2025 04:00 AM UTC
  • Ends 20 May 2025 07:30 PM UTC
  • No Admission Charge


  Speakers

Mahwash Arjumand of Rohde & Schwarz Canada

Biography:

Mahwash is an Application Engineer in Rohde & Schwarz. She has over 14 years of experience in RF and µW test & measurement products.

Dr. Sameh Y. Elnaggar of RMC

Biography:

Sameh Elnaggar holds a Ph.D. in Electrical Engineering with a focus on electromagnetics. He has extensive expertise in signal integrity and channel simulation for next-generation communication systems.


Dr. Ahmed Abdellatif of Microchip

Biography:

Ahmed Abdellatif has over 15 years of experience in high-speed and RF packaging, with a strong background in electromagnetics and advanced interconnect design.