Characterisation, Design and Assembly Considerations for Biodegradable Printed Circuit Boards

#boards #Electronics #biodegradable #materials #testing
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IEEE UK and Ireland Electronics Packaging and Reliability Joint Chapter

and

IEEE UK and Ireland Power Electronics Chapter

Webinar


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  • Date: 05 Jun 2025
  • Time: 02:00 PM UTC to 03:00 PM UTC
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  • Co-sponsored by IEEE UK and Ireland Power Electronics Chapter

  Speakers

Oliver Krammer of Budapest University of Technology and Economics

Topic:

Characterisation, Design and Assembly Considerations for Biodegradable Printed Circuit Boards

As the electronics industry moves toward sustainability, developing and integrating environmentally friendly materials in printed circuit boards (PCBs) have become increasingly significant. This webinar offers an overview of both traditional and emerging materials used in PCB manufacturing, with a focus on biodegradable substrates.

The webinar begins by examining the materials used in classic rigid and flexible PCBs, followed by the latest developments in biodegradable substrate materials. The session will address the mechanical and functional challenges specific to these alternative materials, as well as strategies to enhance their performance in demanding applications.

Participants will gain brief insights into methods for characterising PCB with electrical, mechanical, and thermomechanical testing. The session will explore how biodegradable materials behave, particularly in terms of electrical and mechanical performance.

The webinar will also explore PCB design fundamentals using CAD tools, including best practices for design rule consideration. Specific strategies for improving the stability and yield of boards made from biodegradable materials will also be covered.

The final part covers PCB assembly technologies, including through-hole, surface-mount, and reflow soldering. Special emphasis will be placed on low-temperature soldering techniques suitable for biodegradable substrates, exploring compatible alloy types and the impact of assembly conditions on overall quality and reliability.

Biography:

Dr. Oliver Krammer earned his M.Sc. and Ph.D. in electrical engineering from the University of Technology and Economics in 2005 and 2010, respectively. As an associate professor in the Department of Electronics Technology, he has led multiple industrial projects focused on surface mount assembly, particularly lead-free soldering technologies. He contributed to the LEADOUT and FLEX-NO-LEAD projects, supported by the European Commission under the FP6 framework. His research interests encompass soldering processes, structural analysis of electrical joints, and the analyses of failure mechanisms and the lifetime of electronic circuits. More recently, he has been engaged in two EU-funded projects—BEATRICE (#10056) and DESIRE4EU (#101161251) - which research biodegradable printed circuit boards.

Email:

Address:Budapest, Hungary