Literature Review on Wafer/Chip Bonding
#Wafer/chip
#bonding
#Semiconductor
#packaging
#Heterogeneous
#integration
As the presenter is currently not active in the semiconductor packaging field, the seminar will take the form of a literature review on wafer/chip bonding. By presenting current research trends and challenges, the review aims to provide an overview of recent developments in this area. This approach also serves as an opportunity to explore potential future research directions within the field.
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- Date: 03 Jun 2025
- Time: 02:00 AM UTC to 04:00 AM UTC
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