Keynote on Mass Transfer: How the Push for MicroLED Displays Opens New Paths to Heterogeneous Integration
Keynote to be given at the 25th European Microelectronics & Packaging Conference (EMPC 2025)
Assembling microLEDs into displays is challenging due to the need for precise placement of millions of tiny microLEDs. Fluidic self-assembly, laser transfer, and stamp transfer are all candidate technologies. Among these, elastomer stamp transfer has proven to be a scalable, high-yield solution. The advancements in mass transfer technology are now being applied to heterogeneous integration challenges beyond displays, enabling improved performance and flexibility in combining different types of components into complex electronic systems.
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- World Trade Center
- Grenoble, Rhooe-Alpes
- France
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- Co-sponsored by IMAPS
Speakers
Chris Bower of X Display Company
Mass Transfer
Biography:
Chris Bower is the Chief Technology Officer and co-founder of X Display Company (XDC). Before joining XDC, he was the Chief Technology Officer at X-Celeprint Limited, a company founded to develop and commercialize advanced micro assembly technologies. He was formerly a Technical Manager at Semprius, Inc., where he led the team responsible for elastomer-stamp mass transfer of silicon integrated circuits and compound semiconductor solar cells. His research interests include three-dimensional integration of integrated circuits, heterogeneous integration of compound semiconductors onto non-native substrates and the fabrication of low-cost, large-format electronics using novel assembly methods. He has co-authored over one hundred and thirty scientific publications and over one hundred and fifty patent applications.
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.