Dr. Jose Schutt-Aine of Univ of Illinois

Biography:

José E. Schutt-Ainé received the B.S. degree in electrical engineering from the Massachusetts Institute of Technology, Cambridge, in 1981, and the M.S. and Ph.D. degrees from the University of Illinois at Urbana-Champaign (UIUC), Urbana, in 1984 and 1988, respectively. He joined the Hewlett-Packard Technology Center, Santa Rosa, CA, as an Application Engineer, where he was involved in research on microwave transistors and high-frequency circuits. In 1988, he joined the Electrical and Computer Engineering Department at UIUC where he is currently involved in research on signal integrity for high-speed digital and high-frequency applications. Dr. Schutt-Ainé is an IEEE Fellow, EPS Distinguished Lecturer, and served as Co-Editor-in-Chief of the IEEE Transactions on Components, Packaging and Manufacturing Technology (T-CPMT) from 2007 to 2018. He is currently serving as a member of the Board of Governors for the IEEE Electronics Packaging Society.

Mr. Eric Perfecto of IBM (Retired)

Biography:

ERIC PERFECTO (M’95, SM’01, F’17) has extensive experience working in microelectronics. At IBM, Eric has led the development of multi-level Cu-polyimide advanced packages for high-end systems, followed by the introduction of Pb-free solder interconnects and 2.5D wafer finishing. As part of the IBM Microelectronics Division divestiture, Eric moved to GLOBALFOUNDRIES where he established a Si Photonics packaging development line. In 2019 he returned to IBM part time to establish a heterogeneous integration line in Albany. He holds a M.S. in Chemical Engineering from the University of Illinois and a M.S. in Operations Research from Union College.

An author of more than 80 technical papers and three book chapters, Eric holds 55 US patents and has been honored with two IBM Outstanding Technical Achievement Awards and received the IEEE/EPS William Chen Service Award in 2025. 

Eric served as the 57th ECTC General Chair, the 55th ECTC Program Chair and is the current ECTC Publicity chair.  He is an EPS Distinguished Lecturer, an IEEE Fellow and he is currently EPS Education VP. 

Dr. Ken Butler of WattsButler LLC

Biography:

Ken Butler is a semiconductor industry consultant with WattsButler LLC. Prior to that, he was with Advantest Cloud Solutions (ACS) for four years in both applications marketing and business development roles, and for 36 years with Texas Instruments working in DFT and test generation, semiconductor reliability, analog product and test engineering, and data analytics. Ken has a BS from Oklahoma State University and an MS and PhD from the University of Texas at Austin, all in electrical engineering. He is a Fellow of the IEEE, a Golden Core member of the IEEE Computer Society, and a Senior Member of the ACM. Ken also co-leads the EPS Heterogeneous Integration Roadmap chapter on test technology.

Topics: Semiconductor test and reliability, AI/ML applications and edge computing for test and reliability, test challenges in advanced packaging and heterogeneous integration, product and test engineering, design for testability and automatic test pattern generation

Dr. Annette Teng of AIM Photonics