Industry talk on "Role of PACKAGING & INTERCONNECT in Semiconductor"

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Industry talk on "Role of PACKAGING & INTERCONNECT in Semiconductor" by Dr. Vivek Dutta, Namics


  Date and Time

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  • Seminar Room, Department of EEE
  • IIT Guwahati
  • Guwahati, Assam
  • India 781039
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  Speakers

Dr. Vivek Dutta of NAMICS

Topic:

Role of PACKAGING & INTERCONNECT in Semiconductor

Abstract: This talk, accompanied by interactive discussions, is designed to share the speaker’s insights into Semiconductor Packaging Technology, emphasizing its pivotal role in shaping the next generation of integrated circuit (IC) packaging.
The presentation introduces the semiconductor manufacturing flow, with particular focus on the packaging stages and their underlying purpose. It offers a historical overview of packaging and interconnect techniques, tracing their evolution toward advanced solutions. This transition is actively reshaping the dynamics of IC manufacturing.
The talk explores the increasing complexity of semiconductor packages, highlighting the technical challenges they present. It underscores the rising demand for innovative material-based approaches, requiring interdisciplinary expertise to reframe roadblocks as solvable design and engineering opportunities. Addressing these challenges calls for a cross-functional team of physicists, chemists, and engineers ~ well-versed in materials science (including metals and polymers), mechanical and thermal stresses, heat transfer, corrosion, and electromigration.
Drawing from a diverse career path, the speaker began as a metallurgist in the heavy engineering sector before transitioning into the semiconductor domain. His journey has spanned packaging and interconnect development across the USA, Japan, and Southeast Asia. This session offers a chance to share that unique global experience with the audience.

Biography:

Dr. Vivek Dutta has more than 40+ years of experience in Microelectronics, Display, LED, Metallurgical, and Pharmaceutical Industries in Silicon Valley and overseas (Japan, Singapore, and India). Vivek began his semiconductor career in Silicon Valley, working in the Packaging & Interconnect areas at National Semiconductor. Since then, he has worked in various capacities at Fairchild Semiconductor, Maxim, Cirrus Logic, Johnson Matthey Electronics, APS, Texas Instruments, and Merck KGaA. While he was the CEO of Advanpack Solutions (APS) in Singapore, Vivek introduced the pillar bump technology to the industry, which has now become the foundation for next-generation flip-chip interconnect. In 2021 Vivek was awarded IEEE Life Membership. He was also an advisor to Nippon Steel (Chemical & Metals Co.), Mitsui, Sumitomo Electric, Matsushita Electric, Nisshin Steel in their activities related to strategy, business, and technology development in back-end materials and processes for next-generation microelectronics assembly. Currently he is with Namics, advising on their strategy to support India’s growth in high-tech arena. Dr. Vivek Dutta was a long-time permanent member of the Pacific Institute — a think tank affiliated with MITI (Ministry of International Trade and Industry of Japan).