Power Semiconductor Devices Enabling Technology-for Sustainable Design and Large Environmental Impact
In the last 2 decades the new generation of power devices helped a lot to achieve high power density converters (low weight and volume) at high efficiency ratings, significantly improved reliability and cost reduction. However, this is not enough to protect our environment and take care of our common goal Net Zero CO2 emission by 2050. The E-Waste is increasing significantly, and the natural resources are limited. We have to go for a “Circular Economy” to re-use, re-pair, re-think, re-cycle and re-furbish to protect our environment and consider a Comprehensive Environmental Impact Profile. The miniaturization of converter systems and increased power density, enabled by modern wide bandgap power semiconductor devices, lead to significant materials savings, e.g., on copper and aluminum. Further innovations are needed in life-cycle assessment especially in CO2 Footprint and circular economy. The reliability and ruggedness of these new power semiconductors is driven by an advanced chip design and new interfacing and packaging technology. For ultra-high efficiency and ultra-high power density system solutions WB-devices are being developed. Today we are in an excellent situation of having devices in 3 basic Technology (Silicon, SiC, and GaN)available on the market. The challenges is to find out the most suitable device for a given application. Further on a very important issue in the future will be the Life Cycles Assessment along with Circular Economy.
Date and Time
Location
Hosts
Registration
-
Add Event to Calendar
- 101, Section 2, Kuang-Fu Road, Hsinchu 300044, Taiwan R.O.C.
- Hsinchu, T'ai-wan
- Taiwan
- Building: Delta Hall
- Room Number: Room 215