Nickel and Gold Electroplating, the History and Uses in Electronic Applications
The Huntsville, AL Chapter of the IEEE Electromagnetic Compatibility (EMC) Society invites you to participate in a Technical Meeting on August 14, 2025, featuring a talk given by Mr. Ken Marino of Orbel. The program will begin at 5:30 pm with Mr. Ken Marino of Orbel sponsoring a free meal. Mr. Marino’s technical presentation will begin at approximately 6:20 pm after some short chapter status updates.
Technical Meeting:
Mr. Ken Marino
Orbel
Meal Sponsor:
Mr. Ken Marino
Orbel
Meal – BBQ
Pulled Pork, BBQ Chicken, Potato Salad, Baked Beans, Cole Slaw, Buns, Apple Cobbler, Sweet/Un-Sweet Tea, and Water
Date and Time
Location
Hosts
Registration
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- 965 Exploer Blvd NW
- Huntsville, Alabama
- United States 35806
- Building: East Tower
- Room Number: Fountain View
- Starts 30 July 2025 01:00 PM UTC
- Ends 14 August 2025 05:00 PM UTC
- No Admission Charge
Speakers
Mr. Ken Marino of Exodus Advanced Communications
Nickel and Gold Electroplating, the History and Uses in Electronic Applications
Synopsis: Electroplating plays a critical role in electronic applications within the aerospace sector, providing enhanced conductivity, corrosion resistance, and durability under extreme conditions. This presentation explores key plating materials—such as gold, nickel, solder, and silver—and their specific functions in aerospace electronics, including connector reliability, EMI shielding, and solderability. Emphasis is placed on precision, quality control, and compliance with stringent industry standards like MIL-DTL and ASTMN. Discover how innovation in surface finishing is elevating aerospace reliability and performance to new heights.
Biography:
Ken Marino is President of Orbel Corporation. Throughout Ken’s career he has been involved in photochemical milling and electroplating for the electronics industry. Ken is on the PMCI board of directors and is past President of the Master’s Electroplating society. He also sat on the small business board of NIST and was a reviewer of the EPA’s P2 initiative. Ken lives in Nazareth, PA with his wife Sue of 38 years.
Agenda
“Nickel and Gold Electroplating, the History and Uses in Electronic Applications”
Synopsis: Electroplating plays a critical role in electronic applications within the aerospace sector, providing enhanced conductivity, corrosion resistance, and durability under extreme conditions. This presentation explores key plating materials—such as gold, nickel, solder, and silver—and their specific functions in aerospace electronics, including connector reliability, EMI shielding, and solderability. Emphasis is placed on precision, quality control, and compliance with stringent industry standards like MIL-DTL and ASTMN. Discover how innovation in surface finishing is elevating aerospace reliability and performance to new heights.
Chris Lowe
Chair, Huntsville Chapter
IEEE EMC Society
Email: christopher.lowe@ieee.org