Practical Techniques for Ensuring Power Integrity in High-Speed Designs

#EMI #PDI #PI #SSN #RF
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IEEE North Jersey Section Co-Sponsors the Talk: "Practical Techniques for Ensuring Power Integrity in High-Speed Designs"

 

As signal speeds increase and power rails shrink, maintaining power integrity (PI) becomes a critical challenge in high-speed PCB design. This webinar addresses both the design and measurement strategies essential for a robust power delivery network (PDN) by identifying common hurdles that can disrupt PI, including simultaneous switching noise (SSN), voltage ripple, ground bounce, and EMI. From there, we’ll explore practical techniques to minimize power rail noise through careful power plane design, optimized stack-ups, and understanding return path behavior. Additional focus will be placed on managing loop inductance via stubs and effective decoupling capacitor placement to stabilize the PDN.

 

 

 

 

 


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  • Contact Event Hosts

  • Ajay Poddar (akpoddar@ieee.org), Edip Niver (edip.niver@njit.edu), Durga Mishra (dmisra@njit.edu), (Anisha Apte (anisha_apte@ieee.org)

     

     

     

     

     

     

     

     

     

     

     

     

     

  • Co-sponsored by IEEE North Jersey Section

  Speakers

Mike Schnecker of Rohde & Schwarz

Topic:

Practical Techniques for Ensuring Power Integrity in High-Speed Designs

As signal speeds increase and power rails shrink, maintaining power integrity (PI) becomes a critical challenge in high-speed PCB design. This webinar addresses both the design and measurement strategies essential for a robust power delivery network (PDN) by identifying common hurdles that can disrupt PI, including simultaneous switching noise (SSN), voltage ripple, ground bounce, and EMI. From there, we’ll explore practical techniques to minimize power rail noise through careful power plane design, optimized stack-ups, and understanding return path behavior. Additional focus will be placed on managing loop inductance via stubs and effective decoupling capacitor placement to stabilize the PDN.

 

 

 

 

 

 

 

 

 

Biography:

Mike Schnecker has a BS from Lehigh University and an MS from Georgia Tech, both in electrical engineering. His experience in the test and measurement industry includes applications, sales, and product development, and he has specialized in signal integrity applications using oscilloscopes and other instruments. Before joining Rohde & Schwarz, Mr. Schnecker held positions at LeCroy and Tektronix.

Address:Rohde & Schwarz, , United States

Amit Bahl of Sierra Circuits

Topic:

Practical Techniques for Ensuring Power Integrity in High-Speed Designs

Biography:

Amit Bahl earned his Bachelor of Science in Engineering from UCLA in 1997, launching his career in Silicon Valley's tech industry. In 2009, he assumed the role of Director of Sales and Marketing at Sierra Circuits, with a dedicated focus on democratizing design for manufacturing best practices and guidelines for PCB designers and engineers. Assuming the position of Chief Revenue Officer since 2022, Amit's mission persists: to simplify the PCB design journey for all stakeholders. His unwavering dedication continues to drive Sierra Circuits as a trusted resource for the PCB design community.

Address:Sierra Circuits, , United States