Berkshire Consultants Network Meeting

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Berkshire Consultants Network 

Berkshire Consultants Network Presents:  Next-Generation Microelectronics Manufacturing

 


  Date and Time

  Location

  Hosts

  Registration


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  • Contact Event Host

  • Richard Kolodziejczyk

    P.O. Box 401, Hinsdale, MA  01235

    (413) 655-2623

     E-mail: rkolod@IEEE.org

  • Co-sponsored by Berkshire Section

  Speakers

Mr. Michael Holmes of DARPA's Microsystems Technology Office

Topic:

Next-Generation Microelectronics Manufacturing

 

As technologies push the limits of traditional silicon, the U.S. faces a critical challenge: how to continue delivering high-bandwidth, energy-efficient, multifunctional microelectronics essential for advanced technologies. Conventional 2D scaling is reaching physical and economic limits, and while industry is pursuing advanced packaging, the integration of mixed materials – beyond silicon – remains largely untapped. Yet this integration is essential for achieving the order-of-magnitude improvements that next-generation capabilities will require.

Biography:

 

Mr. Michael Holmes is the managing director of the NGMM program. Prior to joining DARPA in September 2024, Holmes was at Sandia National Laboratories for more than 21 years. In his most recent role at Sandia, he was the senior manager of the protective technologies organization focused on specialized hardware systems security research.




Agenda

 

As technologies push the limits of traditional silicon, the U.S. faces a critical challenge: how to continue delivering high-bandwidth, energy-efficient, multifunctional microelectronics essential for advanced technologies. Conventional 2D scaling is reaching physical and economic limits, and while industry is pursuing advanced packaging, the integration of mixed materials – beyond silicon – remains largely untapped. Yet this integration is essential for achieving the order-of-magnitude improvements that next-generation capabilities will require.