Technical talks and Networking mixer in association with ACM -- 2025 IEEE Day Celebration
Join us on IEEE Day, October 7, 2025, for an evening of cutting-edge tech talks and networking hosted by IEEE Young Professionals.
Join us on IEEE Day, October 7, 2025, for an evening of cutting-edge tech talks and networking hosted by IEEE Young Professionals & ACM Austin chapter. Whether you’re into AI, HPC, next-gen system architectures, or anything in technology, this is your spot to connect, learn, and celebrate what’s next in tech.
Our speakers will dive into what it takes for folks to build performance-demanding systems. Stick around for the networking mixer. Swap ideas, meet peers, maybe even brainstorm a project. We will have pizza and refreshments to keep the conversations flowing.
Whether you’re a grad student, industry engineer, or “just curious,” come be part of IEEE’s global mission: leveraging technology for a better tomorrow.
Date and Time
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- 1218 West Ave
- CGCS – ACC Rio Grande Campus, Building 3000
- Austin, Texas
- United States 78701
- Building: 3000
- Click here for Map
- Contact Event Hosts
- Co-sponsored by ACM Austin Chapter
- Starts 17 September 2025 05:00 AM UTC
- Ends 08 October 2025 05:00 AM UTC
- No Admission Charge
Speakers
Anup
Advancing HPC and AI Through Specialized Architectures
AMD’s journey toward exascale computing has led to the development of advanced Accelerated Processing Units (APUs) and GPUs, exemplified by the AMD Instinct MI300 Series. This series integrates high-performance computing (HPC) and artificial intelligence (AI) capabilities within a single package using AMD’s innovative chiplet architecture, Infinity Cache, and 8-stack HBM3 memory, delivering over 5TBps peak bandwidth. The MI300A and MI300X models leverage advanced heterogeneous integration to enable efficient, domain-specific acceleration for AI and HPC workloads, supporting both CPU-hosted and self-hosted configurations for seamless CPU-GPU synergy in high-density and large model environments. These accelerators reflect AMD’s evolution in packaging and hybrid bonding technologies to drive next-generation AI and exascale performance. This talk will highlight how the MI300A and MI300X accelerate HPC and AI in a domain-specific way.
Key Takeaways
What accelerated processing units are and how they are useful for high-performance computing
Key architectural changes that can be tailored for HPC vs. ML workloads
How AMD addresses increased demands in large LLM model training and inference