Step-by-Step Manufacturing of Multi-layer Printed Circuit Boards (PCB)
Mass manufacture of printed circuit boards (PCBs) on an industrial scale is achieved using complex high precision production lines and machines. Visiting/touring a large, industrial sized PCB manufacturing plant with automated equipment can seem mysterious and often leads to more confusion within the steps and how to relate within the overall process. Worldwide, engineering and technician educational programs often fail to introduce printed circuit board manufacturing within dedicated programs. The resulting lack of knowledge of this process is detrimental to practicing engineers, designers, and technicians who find themselves called upon to act as either dedicated PCB layout engineers or other PCB related roles in this ever-growing field. Effective PCB design and manufacturing require precise and detailed, hands-on knowledge of the overall process, so that PCB designs can be successfully translated into layout and subsequent production by a PCB shop. This presentation will break down the multi-faceted PCB fabrication process into discrete, more clearly delineated micro-processes and methods that can be more easily visualized and understood. Starting from bare laminate and working all the way up to final finish, discussion topics will include photoimaging, drilling, plating, etching, lamination, stack up, and plating.
This presentation will count for 1 Professional Development Hour (PDH) for the PE License in Wisconsin and Michigan.
Date and Time
Location
Hosts
Registration
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- 5 N. Systems Drive
- Appleton, Wisconsin
- United States 54914
- Building: D.J. Bordini Center at FVTC
- Room Number: BC141
- Contact Event Hosts
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Reservations should be received by Tuesday, September 30 by registering from this web page.
The Dinner fee of $20, will be collected at registration.
IEEE Student Members may attend and enjoy dinner at the reduced cost of $10. Student members should register by emailing their IEEE member number to blluchs@ieee.org or oliveira@mtu.edu.
- Starts 19 September 2025 08:00 PM UTC
- Ends 01 October 2025 04:55 AM UTC
- Admission fee ?
Speakers
Dr. Chris Middlebrook of Michigan Technological University
Biography:
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Christopher T. Middlebrook, is a Professor of Electrical and Computer Engineering at Michigan Technological University. Dr. Middlebrook's research and teaching focus is within integrated optical devices and electronic substrate manufacturing and design. He has published over 49 scientific papers and holds one patent. Dr. Middlebrook is a senior member of SPIE and OPTICA. He served a visiting faculty appointment from 2016–2020 with the Naval Surface Warfare Center Crane where he has been engaged in active research within multiple research and engineering teams. He currently holds a visiting faculty research engineer position in the advanced technology team at Scientific Applications International Corporation in support of the DoD Executive Agent for Printed Circuits.
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His work has been recognized by invited speaker engagements across the nation as well as internationally. He was instrumental in creating the ECE department Plexus Innovation Laboratory, which serves as an electronics maker space for students and researchers on campus. Dr. Middlebrook's teaching contributions have been recognized by numerous awards. He has won the HKN Outstanding Electrical and Computer Professor of the Year Award two years (2019/2020 and 2010/2011). Additionally, he was the Michigan Tech Graduate Faculty Mentor Award winner (2010/2011) and has been awarded the Dean’s Teaching Showcase (2021/2022). Finally, he is the recipient of the IPC Michael V. Carano Teacher Excellence Award for 2020 and the Gentec-EO Laser Lab Award. |
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Agenda
5:00 Featured Speaker - Dr. Chris Middlebrook
D.J. Bordini Center at FVTC
6:30 Adjourn to Cheddar's Scratch Kitchen
4531 W Wisconsin Ave
Appleton, WI
6:45 Social time, cash bar open
Order meals from the restaurant menu
7:00 Section announcements, door prize drawing