Bit of a Stretch: Flexible, Stretchable, and Printable Circuits and Systems
ABSTRACT
The basic structure and function of a printed circuit board (PCB) has changed little in the last 50 years; individual integrated circuits and passive components are connected through copper traces, patterned from thin copper sheets laminated to a rigid fiberglass substrate. Advances such as flexible circuit boards, built on polyimide sheets, add some amount of flexibility, but these do not provide stretch or alter traditional 2D circuit topology. In contrast, there is an emerging set of applications that require stretchable, compliant electronics – including wearable devices, instrumented fabrics, and soft robots with distributed sensors and computation. Developing stretchable electronics faces two primary challenges: integration of active semiconductor devices in elastic substrates and providing stretchable, conductive interconnects. In this work, we combine 3D-printing of liquid metal materials with silicone rubber and PCB fabrication techniques to build solid 3D objects with active and passive electronic components distributed throughout. In this presentation, we will summarize our efforts in process development, material characterization, electrical modeling, and stretchable circuit fabrication demonstrating the potential of using liquid metal materials for realizing flexible and stretchable electronic systems. Long-term, we aim to enable wearable sensors and actuators, conformable electronic skins and textiles, and camera-free motion capture capabilities for soft robots and wearable human-machine interfaces.
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- 5951 Village Center Loop Rd
- San Diego, California
- United States 92130
- Room Number: The Nest
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Dr. Matthew Johnston
Topic:
Bit of a Stretch: Flexible, Stretchable, and Printable Circuits and Systems
ABSTRACT
The basic structure and function of a printed circuit board (PCB) has changed little in the last 50 years; individual integrated circuits and passive components are connected through copper traces, patterned from thin copper sheets laminated to a rigid fiberglass substrate. Advances such as flexible circuit boards, built on polyimide sheets, add some amount of flexibility, but these do not provide stretch or alter traditional 2D circuit topology. In contrast, there is an emerging set of applications that require stretchable, compliant electronics – including wearable devices, instrumented fabrics, and soft robots with distributed sensors and computation. Developing stretchable electronics faces two primary challenges: integration of active semiconductor devices in elastic substrates and providing stretchable, conductive interconnects. In this work, we combine 3D-printing of liquid metal materials with silicone rubber and PCB fabrication techniques to build solid 3D objects with active and passive electronic components distributed throughout. In this presentation, we will summarize our efforts in process development, material characterization, electrical modeling, and stretchable circuit fabrication demonstrating the potential of using liquid metal materials for realizing flexible and stretchable electronic systems. Long-term, we aim to enable wearable sensors and actuators, conformable electronic skins and textiles, and camera-free motion capture capabilities for soft robots and wearable human-machine interfaces.
Biography:
Matthew Johnston is a Professor with the School of Electrical Engineering and Computer Science at Oregon State University. He received a B.S. degree from the California Institute of Technology, and M.S. and Ph.D. degrees from Columbia University, all in electrical engineering. He was a Co-Founder and Manager of Research with Helixis, Carlsbad, CA, a Caltech-based spinout developing instrumentation for real-time PCR, from 2007 to its acquisition by Illumina in 2010. At Oregon State, Dr. Johnston’s research interests include the integration of sensors and transducers with silicon CMOS integrated circuits, lab-on-CMOS platforms, ultra-low-power sensor electronics, and stretchable circuits and systems. Dr. Johnston received the 2020 Semiconductor Research Corporation (SRC) Young Faculty Award, the 2021 OSU College of Engineering Faculty Teaching Excellence Award, and the 2024-2025 OSU EECS Faculty of the Year Award. He is currently an Associate Editor of the IEEE Transactions on Biomedical Circuits and Systems and a Distinguished Lecturer for the IEEE Circuits and Systems Society.