Research on Key Technologies of High-Speed Differential Interconnection Based on SISL-Thesis Defense of Doctorate Candidate in the IEEE Tianjin AP/MTT/SSC Joint Chapter

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Thesis Defense of Doctorate Candidate, Yongyun Wang, in the chapter



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  • No.92 Weijin Road
  • Tianjin, Tianjin
  • China 300072
  • Building: NO.20 Building
  • Room Number: 228

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Mr. Yongyun Wang

Topic:

Research on Key Technologies of High-Speed Differential Interconnection Based on SISL

High-speed data transmission systems play an important role in high-speed signal processing and transmission. Among them, differential transmission lines, with their excellent anti-interference ability, have become the core carrier of high-speed signal transmission and processing in this system. With the rapid development of the information industry, high-speed data transmission systems are facing dual challenges: higher transmission rates and stronger anti-interference capabilities. The design of high-speed differential interconnect circuits and related circuits can meet this challenge and solve the above core needs. Therefore, this thesis studies the key technologies of differential circuits and related RF front-end circuit modules in high-speed differential interconnect systems, utilizing substrate integrated suspended line (SISL) and hybrid-substrate integrated suspended line (HISL).

Biography:

Yongyun Wang (Graduate Student Member, IEEE) received the B.E. degree in electrical engineering from Nanchang Hangkong University, Nanchang, China, in 2014, and the M.S. degree from the Civil Aviation University of China, Tianjin, China, in 2019. He is currently pursuing the Ph.D. degree at the School of Microelectronics, Tianjin University, Tianjin. His current research interests include high-speed data transmission, substrate integrated suspended lines, interconnect modeling, and signal integrity analysis.