Ninth Annual Symposium on Heterogeneous Integration Roadmap and Annual Meeting

#HIR #packaging #electronics #integration
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Vision for Heterogeneous Integration from Global Perspectives, 2 days, keynote talks, working groups ...

 [Updated Agenda will be live here

1: Registration is $145 ($125 for IEEE members, and discounts for students). PayPal is the credit card payments processor; please do not use your Paypal account during the payment process here.

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3: STUDENTS: Current or recent graduate students please contact academic liaison Luu Nguyen  luun296@gmail.com or Hualiang Shi hualiang.shi@ieee.org with research interest and using institution domain email for registration information.

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  Date and Time

  Location

  Hosts

  Registration



  • Add_To_Calendar_icon Add Event to Calendar
  • SEMI INTERNATIONAL HEADQUARTERS
  • 673 S MILPITAS BLVD
  • MILPITAS, California
  • United States 95035

  • Contact Event Host
  • Confirmation of your registration is immediately sent.  

    You should be getting a receipt of the payment processed [PayPal does it for us].

    Please save for expense reimbursement etc.

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  • Starts 13 November 2025 08:00 AM UTC
  • Ends 19 February 2026 08:00 AM UTC
  • Admission fee ?
  • Menu: Vegetarian, Regular, No preference


  Speakers

Topic:

ALL

all available bio's will embedded in the Agenda as pop-up/ links





Agenda

Agenda updates here.

 

Time                   19-Feb

February 19th Presenter Affilation
8:30 – 8:45 Introduction: Bill Chen ASE Fellow & Senior Technical Advisor at ASE Group
8:45 – 9:15 Ajit Manocha President and CEO SEMI
9:15 – 9:45 Hai Ah Nam HPC Technology Department Head,

 

Lawrence Berkeley National Laboratory

9:45 – 10:00 Break  
10:00 – 10:30 Ritesh Jain SVP of Engineering and Operations, Lightmatter
10:30 – 11:00 Jean-Philippe (J.P.) Fricker CEO and CoFounder, Cerebras
11:00 – 11:30 Dereje Agonafer The University of Texas at Arlington
11:30 – 12:00 Devan Iyer Global Electronics Association
12:00 – 1:15 Lunch  
1:15 – 5:30 TWG Member Activities:  TWG to TWG discussions and Session on Roadmap Attributes  
5:30 – 6:30 Wine Tasting/Social Hour  
February 20th Presenter Affilation
8:00 – 12:15 TWG Member Activities:  TWG to TWG discussions and Volunteer Management discussion  
12:15 – 1:15 Lunch  
1:15 – 1:45 PM Sheng Xu Professor, Stanford University
1:45 –  2:15 PM Doug Hackler President and CEO American Semiconductor

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