EMC and SI challenges with SerDes Camera Systems for Automotive Driver Assisted Technologies

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IEEE Southeastern Michigan: Chapter VIII (EMC)

 

 


Southeastern Michigan IEEE EMC Chapter technical meeting.

 

 

Keith Frazier

Sponsor:  Southeastern Michigan IEEE EMC Society.  We will have a drawing for 3 Amazon Gift Cards after the presentation.  You must be present to win. 



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  • Starts 20 January 2026 05:00 AM UTC
  • Ends 19 February 2026 10:00 PM UTC
  • No Admission Charge


  Speakers

Keith Frazier

Topic:

EMC and SI challenges with SerDes Camera Systems for Automotive Driver Assisted Technologies

Road Safety has vastly increased due to continued development in Automotive Driver Assisted Systems (ADAS).  A critical element of these systems are high resolution cameras.  To facilitate high data transfer between camera and ADAS ECU, the use of serial  / de-serializer (“SerDes”) communication links, which consist of coaxial cable interconnects.  The talk will focus on the challenges in using SerDes in an automotive environment with special focus on required interconnect shielding performance.  The talk will include review of past and current USCAR requirements that support this technology.

 

Biography:


Keith Frazier is a Life Senior Member of IEEE and has been practicing EMC engineer for over 48 years. Prior to his retirement from Ford Motor Company in February 2025, Keith served as Ford’s Senior Technical Leader of Electromagnetic Compatibility with responsibility and oversite of all EMC design of automotive products worldwide. He has been the author for all Ford global EMC requirements for vehicles, subsystem and components since 2002. His interests include system/subsystem design and analysis for EMC.  Between receiving his BSEE from Purdue University in 1976 and joining Ford in 1990, Keith served as an EMC and TEMPEST design engineer for various automotive and aerospace firms including GM, Lockheed and Magnavox Government Electronics (now Raytheon).


Keith has authored and presented multiple technical papers and presentations at regional and international symposia. He has also authored and co-authored multiple SAE, ISO and CISPR D standards as an active member of the USTAG to ISO TC22/SC32/WG3 and CISPR D international standards committees.  Keith served as Technical Papers Co-chair for the 2008 IEEE EMC Symposium held in Detroit
Michigan. In the fall of 2023, he was elected member at large of the EMC Society’s Board of Governors for 2024-2026.

 

 

Email:

Address:Dearborn, Michigan, United States





Agenda

5:30  Networking and Zoom setup

6:00 Presentation



Chapter website: http://www.emcsociety.org

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