Mr. David Haeussler has spent over 30 years providing design services and support to 
electronics companies architecting and implementing the most innovative silicon chips. He 
earned his BS and MS Computer Engineering degrees at Clemson University, where he studied 
integrated circuit electromigration failure as part of his graduate work. After graduating from 
Clemson, David worked for IBM in Poughkeepsie NY, where he implemented design tools for 
thermal conduction modules in the IBM ES9000 mainframe systems. David left IBM in the mid
nineties to go to a relatively small, San Jose CA based company called Cadence Design Systems, 
where he started as an IC physical design application engineer. His roles at Cadence have 
included design services engineer, project manager and project management office director. 
Except for three years spent in Edinburgh Scotland, David has worked from the Cadence office 
in Cary NC throughout his career at Cadence. David is currently an Operations Senior Group 
Director in the Cadence Customer Success Team, with worldwide responsibilities that include 
key services engagements, capital expense management and mergers/acquisitions.