EPS/EDS Minicolloquium- Device and Packaging Innovation for Next-Gen AI/HPC Systems
#bonding
#chiplets
#heterogeneous
#integration
#packaging
#AI
#HPC
A series of speakers covering device and packaging innovations for next-gen AI/HPC systems. Registration is free but mandatory. Breakfast and lunch will be provided for all registered attendees. Parking information will be sent out after registration.
Date and Time
Location
Hosts
Registration
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- 1220 Washington Ave
- Albany, New York
- United States
- Building: ETEC
- Room Number: 149/151
- Starts 23 February 2026 05:00 AM UTC
- Ends 10 April 2026 08:00 PM UTC
- No Admission Charge
Speakers
Fernando Guarin of IEEE
Topic:
100th Anniversary of the Transistor and an Overview of the Semiconductor Industry Today
Mudasir Ahmed of Cisco
Topic:
Advanced Packaging for Artificial Intelligence Applications: Technical Challenges
John Shalf of Berkeley National Laboratory
Topic:
The Power of Analogous Computing Specialization, Modularity, and Scalability for the Future of Energy Efficient Computin
John Kymissis of Columbia University
Topic:
MicroLEDs- A Revolution in Displays and Optoelectronic Applications
Bahgat Sammakia of Binghamton University
Topic:
Overview of Thermal Management and Digital Twin for AI Data Centers and Next Generation of Electronic Systems
Francesca Iacopi of Indiana Semiconductor R&D Center, IMEC USA
Topic:
2D Materials for Nanoelectronics and Nanophotonics: an R&D Perspective
Srikanth Rangarajan of Binghamton University
Topic:
Overview of Thermal Management and Digital Twin for AI Data Centers and Next Generation of Electronic Systems
Agenda
8:30 AM Breakfast
9:15 AM Opening remarks, speaker session 1
10:30 AM Break
10:50 AM Speaker session 2
noon Lunch
1:30 PM Speaker session 3
2:30 PM Closing remarks