Diamond Semiconductor Device Design & Fabrication

Diamond Quanta: making diamond as available as silicon

Laser Annealing for Electronic-Quality Diamond

 

Abstract:

Diamond’s extreme thermal conductivity, wide bandgap, high breakdown field, stiffness, and radiation hardness make it a compelling platform for power microelectronics, photonics, and quantum technologies. But its performance is often limited by defects that scatter carriers, perturb color-center environments, and degrade quantum coherence. Conventional polishing and growth processes typically create defects near the surface, where they will have the greatest impact on electronic and optical performance. For many applications, a key challenge is to convert commercially available diamond plates into device-ready surfaces over large areas.

In collaboration with Lawrence Livermore Lab, Diamond Quanta is developing sub-melt nanosecond Pulsed‑Laser Annealing (PLA) - a controllable, scalable means to reconfigure carbon bonding and relieve near‑surface strain without melting. This method produces low-defect, device-ready surfaces from industrial-grade diamond, with applications in high-power electronics, photonics, and quantum-grade substrates and wafers.

Read More:
Reducing dislocation defect levels via sub-melt nanosecond pulsed-laser induced densification of diamond
Advanced co-doping techniques for enhanced charge transport in diamond-based materials

Speaker:

Adam Khan

Founder & CEO

Diamond Quanta