Terabit DSL over Copper: Exploring Sub-THz Waveguide Transmission for Future 6G Networks
#WIE
#ap-mtts-sbc
#kharagpur
#RF
#Microwave
#technology
#5G
#6G
#communications
#hollow-waveguides
#D-band
The talk "Terabit DSL over Copper: Exploring Sub-THz Waveguide Transmission for Future 6G Networks" started with a brief introduction of the speaker, Dr. Fauziahanim Che Seman. The speaker gave a brief overview about associated IEEE society, chapter along with her professional journey.
Following things were presented in this talk:
The rapid growth in global data traffic driven by emerging applications such as 6G communications, holographic telepresence, and ultra-high-resolution video streaming (16K/32K) is pushing existing wireless and wired infrastructures toward their capacity limits. While the Terahertz (THz) spectrum offers a promising solution to address this demand, the widespread deployment of fiber-optic networks remains constrained by high capital expenditure and infrastructure rollout challenges. Consequently, exploring alternative high-capacity transmission solutions that leverage existing infrastructure has become increasingly important.
This presentation investigated the feasibility of Terabit Digital Subscriber Line (TDSL) technology, which aims to utilize existing twisted-pair copper cabling for ultra-high-speed data transmission in the sub-THz regime. Specifically, the study evaluates the potential of metallic waveguide-based transmission structures operating in the D-band (100–300 GHz) to support terabit-per-second data rates.
Two primary transmission configurations are examined: (i) circular hollow waveguides designed to emulate the air channels within CAT6 cables, and (ii) copper wire waveguides consisting of two-wire and four-wire structures, implemented in both bare-metal and dielectric-coated configurations. The research methodology integrates full-wave electromagnetic simulations using CST Microwave Studio, experimental characterization using Terahertz Time-Domain Spectroscopy (THz-TDS), and analytical channel modeling implemented in MATLAB.
The results indicate that dielectric coating on copper wires significantly improves electromagnetic field confinement, leading to increased surface current density and stronger electric field coupling between conductors compared with bare-wire configurations. These findings highlight the strong potential of metallic sub-THz waveguide-based transmission for enabling ultra-high-speed short-range data links. With continued advancements in THz device technologies and coupling mechanisms, Terabit DSL could provide a practical and cost-effective pathway toward future beyond-5G and 6G broadband access networks.
The talk was concluded at 6:30 PM IST with a Q&A session of 10 minutes, in which audience interacted with the speaker.
Date and Time
Location
Hosts
Registration
-
Add Event to Calendar
Loading virtual attendance info...
Speakers
Prof. Fauziahanim Che Seman of Universiti Tun Hussein Onn Malaysia (UTHM)
Topic:
Terabit DSL over Copper: Exploring Sub-THz Waveguide Transmission for Future 6G Networks
Biography:
Prof. Ir. Dr. Fauziahanim Che Seman received her Bachelor’s degree in Electrical Communication Engineering from Universiti Teknologi Malaysia in 2001, her Master’s degree from Universiti Tun Hussein Onn Malaysia in 2003, and her Ph.D. from Queen’s University Belfast, U.K., in 2011. She is currently a Professor at Universiti Tun Hussein Onn Malaysia (UTHM), where she leads the Research Center of Applied Electromagnetics.
Her research interests include THz material sensing, sub-THz communication systems, metamaterials and frequency selective surfaces, antenna design and propagation, and AI-enabled communication systems. She has authored numerous journal articles and conference papers and holds several patents in related fields. Prof. Fauziahanim has played significant roles in international conferences, serving as Technical Chair and committee member for several events, including IEEE APMC 2017, IEEE RFM, the IEEE APACE Conference Series, AWPT 2021, and ISAP 2023. She served as the Chair of the IEEE AP/MTT/EMC Malaysia Joint Chapter from 2017 to 2020 and currently leads the AP Technical Meeting under the same chapter.
She has been an active member of the IEEE MTT-S Women in Microwaves (WiM) Subcommittee since 2018, contributing to initiatives that promote engagement and dialogue among women engineers in microwave engineering across Malaysia and the ASEAN region. She also serves on the IEEE Women in Engineering (WIE) Malaysia committee and was recently selected as the 2026 IEEE WIE Day Ambassador, recognizing her contributions to advancing the participation and visibility of women in engineering and technology.
