Tiny Antennas, Big Impact: Challenges and Innovations in On-Chip Antenna Design
What if the antenna could be as integrated as the transistor? As wireless systems push the boundaries of miniaturization, speed, and integration, the concept of on-chip antennas is rapidly transforming from a niche curiosity to a cornerstone of next-generation RF, microwave, and millimeter-wave technologies.
This talk explores the intriguing world of on-chip antennas—where electromagnetic radiation meets silicon real estate. We delve into the fundamental challenges of antenna miniaturization, substrate losses, and impedance matching, and examine how innovative design strategies are overcoming these barriers. From CMOS-compatible layouts to metamaterial-inspired structures, on-chip antennas are enabling seamless integration of wireless functionality directly into ICs.
Why does this matter? Because the future of high-speed communication, radar sensing, and chip-to-chip wireless interconnects depends on it. Whether it's for 5G/6G transceivers, biomedical implants, or terahertz imaging systems, on-chip antennas are poised to unlock new possibilities across the RF, microwave, and millimeter-wave spectrum.
Join me as we walk through the milestones of on-chip antenna development and ask: Can antennas truly become native to silicon? And if so, what new frontiers will that open?
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- Co-sponsored by Rama estudiantil de la Universidad de Buenos Aires
Speakers
Arup of Qualcomm India Private Limited, Bangalore, India
Tiny Antennas, Big Impact: Challenges and Innovations in On-Chip Antenna Design
What if the antenna could be as integrated as the transistor? As wireless systems push the boundaries of miniaturization, speed, and integration, the concept of on-chip antennas is rapidly transforming from a niche curiosity to a cornerstone of next-generation RF, microwave, and millimeter-wave technologies.
This talk explores the intriguing world of on-chip antennas—where electromagnetic radiation meets silicon real estate. We delve into the fundamental challenges of antenna miniaturization, substrate losses, and impedance matching, and examine how innovative design strategies are overcoming these barriers. From CMOS-compatible layouts to metamaterial-inspired structures, on-chip antennas are enabling seamless integration of wireless functionality directly into ICs.
Why does this matter? Because the future of high-speed communication, radar sensing, and chip-to-chip wireless interconnects depends on it. Whether it's for 5G/6G transceivers, biomedical implants, or terahertz imaging systems, on-chip antennas are poised to unlock new possibilities across the RF, microwave, and millimeter-wave spectrum.
Join me as we walk through the milestones of on-chip antenna development and ask: Can antennas truly become native to silicon? And if so, what new frontiers will that open?
Biography:
Arup Ray (Member, IEEE) received the B. Tech. and M. Tech. degrees in Electronics & Instrumentation and Communication Engineering from the University of Kalyani, India. He earned his Ph.D. degree in 2022. His dissertation focused on the design methodologies and integration challenges of on-chip antennas with RF front-end circuits such as low-noise amplifiers (LNAs) and rectifiers. In 2022, Dr. Ray joined Qualcomm India Private Limited, Bangalore, as a Senior Engineer. He is currently working as a Senior Lead Engineer in the RFIC team. His work involves electromagnetic modeling, RF component design, and coupling mitigation at chip and package level, with a focus on innovation and performance optimization. He has contributed to three novel ideas at Qualcomm, all of which have been filed as U.S. patent applications.
Dr. Ray is a corporate member of the IEEE and the Institution of Engineers (India). He has been actively involved in IEEE activities, having served as Chair of the IEEE AP-MTTS Student Branch Chapter at IIT Kharagpur. He has authored or co-authored nine journal papers and three conference papers in the areas of RFIC design, antenna integration, and electromagnetic simulation. In addition to his research contributions, he has served as a peer reviewer for several international journals, including IEEE Antennas and Wireless Propagation Letters, IEEE Transactions on Components, Packaging and Manufacturing Technology, Springer Scientific Reports, IETE Journal of Research, and IET Microwaves, Antennas & Propagation.