IEEE CEDA SMS 2026 – Semiconductor Manufacturing Symposium

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The IEEE CEDA Bangalore Chapter successfully conducted the Semiconductor Manufacturing Symposium 2026 (IEEE CEDA SMS 2026), a full-day industry-academia symposium held on 28 June 2026 at DoubleTree by Hilton, Bengaluru Whitefield, Karnataka. Organised under the theme "Powering India's Semiconductor Future", the event brought together 187 participants comprising industry leaders, researchers, academicians, and students from across India.

The symposium featured six keynote talks covering the complete semiconductor manufacturing value chain — from fabrication and packaging to fab construction, EDA, and AI in manufacturing. Two panel discussions provided an open platform for thought leaders to debate India's role in semiconductor manufacturing and the transformation of the talent landscape.

Speakers included Dr. Kamaljeet Singh (Director General, Semi-Conductor Laboratory, Chandigarh), PVG Menon (Tata Projects Limited), Gangadhar Yalaga (Teradyne), Murtuza Mithi (SanDisk), John Sandeep (L&T Construction), and Jai Shankar Ramanathan (Tessolve).

The event was supported by SanDisk (Event Sponsor), Teradyne and Tessolve (Silver Sponsors), Eximietas Design, L&T EduTech and IEEE WIE (Bronze Sponsors), and KSSEM, VIT Vellore and Sai Vidya Institute of Technology (Academia Sponsors).



  Date and Time

  Location

  Hosts

  Registration



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  • DoubleTree by Hilton Bengaluru Whitefield
  • ITPL Main Rd, EPIP Zone, Brookefield
  • Bengaluru, Karnataka
  • India 560037
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  Speakers

PVG Menon of Tata Projects Limited

Topic:

India Ecosystem on Semiconductor Manufacturing

Gangadhar Yalaga of Teradyne

Topic:

End-to-End Semiconductor Manufacturing Process


Dr. Kamaljeet Singh of Semi-Conductor Laboratory, Chandigarh

Topic:

Relevance and Challenges of Semiconductor Manufacturing

Murtuza Mithi of SanDisk

Topic:

Flash Forward: Shaping Manufacturing Testing in Zettabyte Era


John Sandeep of L&T Construction, Inc.

Topic:

What it takes to build a FAB

Jai Shankar Ramanathan of Tessolve

Topic:

Post Si Process: Complete Journey from Package to Production






Agenda