Packaging Challenges in MEMS-based Inertial Measurement Units

#IMU #MEMS #Accelerometer #Gyro #navigation #sensor #microsystems
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by Mike Flaherty of Analog Devices, Inc.

MEMS-based IMUs are sensing units that provide motion measurement in rotational and linear direction, and occasionally other sensing modalities of pressure or temperature are added to it. In past, IMU sensing units were designed using small discrete sensors with limited axes which were then combined to form integrated units in small form factor modules. As MEMS silicon manufacturing processes matured, IMUs have been designed into a single silicon with performance tradeoffs.IMUs in single silicon have been commercialized for mass market like consumer and handheld applications driven by need for scale, lower cost, short life cycle, lower power, and higher mechanical reliability challenges. In navigational use cases, such as in automotive, industrial, and aerospace, IMUs are still designed with discrete sensors due to extremely high precision, repeatability, long life, and embedded processing. The question is: what are the challenges that makes designers to implement IMUs using integration of multiple (discrete) sensors?


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  • 147 South Bedford Street
  • Northeastern University Burlington Campus
  • Burlington, Massachusetts
  • United States 01803
  • Building: Bldg 5
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  • Starts 19 May 2026 06:00 PM UTC
  • Ends 28 May 2026 09:00 PM UTC
  • No Admission Charge

  Speakers

Mike of Analog Devices Inc.

Biography:

Mike Flaherty received his Bachelor’s of Science in Electrical & Computer Engineering from Worcester Polytechnic Institute in 2012. Joining Analog Devices in 2012, Mike started his career as a Test Development Engineering specializing in MEMS based Inertial Measurement Units (IMUs) focused on improving test cost, time and performance for Gyroscopes, Accelerometers, Barometers and Magnetometers. In 2018, Mike transitioned to a path of module level assembly and packaging of IMUs. In this time, he has focused on rapid prototyping, design for manufacturing, upscaling packaged based performance, and reducing overall module size and cost. Currently, Mike leads IMU module New Product Initiatives and internal package prototyping for ADI.




Agenda

6:00 - 6:45 Light Dinner and Networking

6:45 - 7:45 Technical Talk