Master the Challenges of Your Electronic Circuit Boards: From Design to Production

#Power #circuits #Mixed-signal #systems #Thermal # #management
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For over 65 years, Gentec has been a leader in the field of power electronics. As part of this commitment, they are proud to host a symposium bringing together experts and professionals from the industry.

🎯 Who should attend?

Electrical engineers and technicians involved in the development of electronic boards including:

  • Power circuits
  • Mixed-signal systems
  • Thermal management

💡 Why attend?

Power electronics plays a critical role in:

  • Energy conversion (rectifiers, inverters)
  • Control and regulation
  • Charging and protection

It is central to many industries, including energy, transportation, defense/aerospace, telecommunications/radar, and medical.

Despite its importance, expertise in power electronics remains fragmented, with limited knowledge sharing across organizations.
👉 This symposium aims to create a central platform for discussion, collaboration, and best practice sharing.

 



  Date and Time

  Location

  Hosts

  Registration



  • Add_To_Calendar_icon Add Event to Calendar
  • 1100 Rue Notre-Dame Ouest
  • ÉTS (École de technologie supérieure)
  • Montreal, Quebec
  • Canada H3C 1K3

  • Contact Event Hosts
  • Starts 03 June 2026 04:00 AM UTC
  • Ends 13 June 2026 04:00 PM UTC
  • No Admission Charge


  Speakers

Gentec – Power Electronics Symposium

Éric Duchesne - Arrow Electronics
Éric Lavigne - Future Electronics
Nicolas Ouellet - Gentec
Jean-Marc Cyr - Ondulo Énergies

Arrow: SST (Solid State Transformers) enabled by Wide Band Gap power semiconductors

Calogy Solutions: Uni.T®: Rethinking thermal management to unlock higher system performance

Cysca Technologies: Design and Simulation of a SiC Totem-Pole PFC for EV Onboard Charging

Gentec: Power Electronics: Assembly Challenges and Key Considerations

MRE Innovation: Diagnosing and Redesigning Around Premature Failures in Wind Turbine Power Electronics: A Case Study

Mobius Electronic: The Magic Behind the Ground Symbol — Finally Demystified!

Ondulo Énergies: Alimentation à découpage à commutation douce

Phoenix Contact: Latest Trends in device connectivity

TTM: PCB Thermal Management for High-Density Power Electronics

Vendel: Le Secure by Design : un levier stratégique.

Link for registration: https://www.eventbrite.ca/e/billets-symposium-sur-lelectronique-de-puissance-1989123962317?aff=oddtdtcreator

Registration is free and includes:

  • Access to all 12 conference sessions
  • Morning coffee and pastries
  • Boxed lunch
  • Networking cocktail reception (5:00–7:00 PM)

Address:Quebec, Canada





Agenda

🧠 Topics:

Calogy Solutions : Uni.T®: Rethinking thermal management to unlock higher system performance

Cysca Technologies : Design and Simulation of a SiC Totem-Pole PFC for EV Onboard Charging

Gentec : Power Electronics: Assembly Challenges and Key Considerations

MRE Innovation : Diagnosing and Redesigning Around Premature Failures in Wind Turbine Power Electronics: A Case Study

Mobius Electronic : The Magic Behind the Ground Symbol — Finally Demystified!

Ondulo Énergies : Alimentation à découpage à commutation douce

Phoenix Contact : Latest Trends in device connectivity

TTM : PCB Thermal Management for High-Density Power Electronics

Vendel : Le Secure by Design : un levier stratégique.