Dr. Nicholas Jankowski of The U.S. Army Research Laboratory (ARL)

The Army Research Laboratory has spent the past several decades, developing high-performance electronics for demanding applications. As heat remains the primary performance limiter for many components, effort has been made to identify thermal packaging strategies that improve performance and reduce the overdesign inherent in applying steady state solutions to transient systems. Dr. Nicholas Jankowski will review efforts to reduce the packaging thermal stack and integrate transient material solutions at timescales relevant to electronic components and discuss challenges presented by new electronic materials and devices.

Biography:

Dr. Nicholas Jankowski is the Deputy Chief of the High Frequency Electronics and Materials Branch at the Army Research Laboratory (ARL) under the U.S. Army's Combat Capabilities Development Command (DEVCOM) in Adelphi, MD.  He has been a federal employee at the Laboratory since 2004, and is currently focused on establishing a diamond electronics and packaging lab for high-efficiency radar, communications, and sensor equipment.  At ARL Nicholas has managed multi-agency research programs on advanced microelectronics and stood up Laboratory's Thermal Science and Engineering team on high-power electronics cooling and packaging.  Dr. Jankowski earned a BS in Mechanical Engineering at Rowan University's, a MS in Electrical Engineering from the University of Virginia, and a PhD in Mechanical Engineering from the University of Maryland with a research focus on transient heat transfer with phase change materials in high-power systems.