Technical Seminar - "The latest semiconductor and interconnect devices and components used in power electronics and PCB circuits"
Infineon – „New semiconductor modules and components, current sensors, power electronics solutions”
Lattice – „Energy conversion, grid parameters monitoring, cybersecurity”
TE Connectivity – „PCB relays, Contactors, Passive Componnents, Switches, Filers”
Yageo – „Key component highlight for high power solutions, magnetic components for SiC/GaN High Power Application
(HF Transformers, Inductors, CST, Rogowski Coils)
Throughout the event, you'll have the opportunity to visit the stands of individual exhibitors, learn about the latest components, and talk to company representatives.
Date and Time
Location
Hosts
Registration
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- Koszykowa 75
- Warsaw, Mazowieckie
- Poland
- Building: SK
- Room Number: 4 & 5
Speakers
Companies
Different Companies
Infineon – „New semiconductor modules and components, current sensors, power electronics solutions”
Lattice – „Energy conversion, grid parameters monitoring, cybersecurity”
TE Connectivity – „PCB relays, Contactors, Passive Componnents, Switches, Filers”
Yageo – „Key component highlight for high power solutions, magnetic components for SiC/GaN High Power Application
(HF Transformers, Inductors, CST, Rogowski Coils)