Building a Successful IEEE Fellow Nomination: Process, Criteria, and Best Practice
The IEEE Fellow grade is one of the highest distinctions in the engineering profession, recognizing individuals whose technical contributions have had a profound and lasting impact on society. Despite its prestige, the Fellow elevation process is often perceived as complex and difficult to navigate. This seminar provides a clear, structured, and practical overview of the IEEE Fellow nomination process, with the goal of helping prospective candidates and nominators understand what constitutes a strong and competitive nomination. The presentation will cover:
- How to assess readiness and eligibility for IEEE Fellow nomination
- IEEE Fellow evaluation and selection criteria
- Key elements of a high-quality nomination package
- How to select the most appropriate technical contribution category
- Key success factors and common pitfalls to avoid
Whether you are considering your own nomination or supporting the nomination of colleagues, this seminar offers an excellent opportunity to gain authoritative insights into the IEEE Fellow review process and best practices for success.
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- Starts 06 July 2026 04:00 AM UTC
- Ends 30 July 2026 01:00 PM UTC
- No Admission Charge
Speakers
Yong (Peter) Lian
Building a Successful IEEE Fellow Nomination: Process, Criteria, and Best Practice
Yong (Peter) Lian (M’90–SM’99–F’09) is the Vice Chair of IEEE Fellow Committee, Chair of IEEE Technical Activities Board (TAB) Ad Hoc Committee on Developing AI Driven Multimedia Content, Co-Chair of IEEE TAB Ad Hoc Committee on Enhance TAB Organizational Effectiveness, Member-at-Large of IEEE Innovation Committee, and member of IEEE New Initiative Committee. Over the years, he has held numerous leadership positions within IEEE, including the IEEE Board of Directors, Division I Director, member of the IEEE TAB, Member-at-Large of the IEEE Publication Services and Products Board (PSPB), Chair of the IEEE Periodicals Partnership Opportunities Committee, Chair of the IEEE Ad Hoc Committee on Accelerating Partnerships with Chinese Publications, and membership in the IEEE Periodicals Committee, the Periodicals Review and Advisory Committee, the Products and Services Committee, the PSPB Strategic Planning Committee, the MGA Strategic Planning Committee, and the Fellow Committee. He also served as the President of the IEEE Circuits and Systems Society, Editor-in-Chief of the IEEE Transactions on Circuits and Systems II: Express Briefs, Vice President for Publications, and Vice President for Region 10 of the IEEE Circuits and Systems Society. Dr. Lian is the founding Editor-in-Chief of the journal Integrated Circuits and Systems.
Dr. Lian is a leading researcher in ultra-low power smart wireless sensors, energy-efficient event-driven signal processing, and biomedical circuits and systems. His pioneering contributions to these fields have earned him more than 20 awards, including the 2023 IEEE Circuits and Systems Society Mac Van Valkenburg Award, the 2023 IEEE Transactions on Biomedical Circuits and Systems Best Paper Award, the Design Contest Award at the 2015 International Symposium on Low Power Electronics and Design, the 2011 Institution of Engineers Singapore Prestigious Engineering Achievement Award, the 2008 IEEE Communications Society Multimedia Communications Best Paper Award, and the 1996 IEEE Circuits and Systems Society Guillemin-Cauer Award.
Address:Toronto, Canada